Inventor · disambiguated record

Heiko Aus Dem Spring

Also filed as: SPRING HEIKO AUS DEM

1 granted patent·15 citations·filing 2007–2007

35Inventor score

Technology areasH10P

Files withSILTRONIC AG1

Top patents by PatentIndex Score

1 record

0183US7815489B2Method for the simultaneous double-side grinding of a plurality of semiconductor wafersSILTRONIC AG·Filed 2007·Granted Oct 19, 2010·15 cites·24 claims

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