Inventor · disambiguated record
Franciscus Henrikus Martinus Swartjes
Also filed as: SWARTJES FRANCISCUS HENRIKUS MARTINUS
3 granted patents·1 pending application·35 citations·filing 2015–2021
72Inventor score
Technology areasH10W
Files withNXP BV4
Top patents by PatentIndex Score
4 records- 0193US9466585B1Reducing defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2015·Granted Oct 11, 2016·17 cites·12 claims
- 0292US10177111B2Reduction of defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2017·Granted Jan 8, 2019·10 cites·12 claims
- 0390US9704823B2Reduction of defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2015·Granted Jul 11, 2017·8 cites·4 claims
- 0448US2023137977A1Stacking a semiconductor die and chip-scale-package unitNXP BV·Filed 2021·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →