Inventor · disambiguated record
Juan-Yuan Wu
Also filed as: WU JUAN · WU JUAN-YUAN
65 granted patents·7 pending applications·1,272 citations·filing 1997–2025
99Inventor score
Files withUNITED MICROELECTRONICS CORP61UNIV JIANGSU TECHNOLOGY2LENOVO BEIJING LTD1LIU CHIH-CHIEN1THE FIRST AFFILIATED HOSPITAL OF XIAN JIAOTONG UNIV1
Top patents by PatentIndex Score
72 records- 0197US6203863B1Method of gap fillingUNITED MICROELECTRONICS CORP·Filed 1998·Granted Mar 20, 2001·318 cites·20 claims
- 0295US8062536B2High density plasma chemical vapor deposition processLIU CHIH-CHIEN·Filed 2010·Granted Nov 22, 2011·20 cites·12 claims
- 0384US7271101B2High density plasma chemical vapor deposition processUNITED MICROELECTRONICS CORP·Filed 2005·Granted Sep 18, 2007·6 cites·32 claims
- 0483US6093089AApparatus for controlling uniformity of polished materialUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jul 25, 2000·55 cites·10 claims
- 0582US6117345AHigh density plasma chemical vapor deposition processUNITED MICROELECTRONICS CORP·Filed 1997·Granted Sep 12, 2000·44 cites·21 claims
- 0678US6838357B2Chemical mechanical polishing for forming a shallow trench isolation structureUNITED MICROELECTRONICS CORP·Filed 2002·Granted Jan 4, 2005·13 cites·23 claims
- 0777US6077147AChemical-mechanical polishing station with end-point monitoring deviceUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jun 20, 2000·42 cites·10 claims
- 0875US6344408B1Method for improving non-uniformity of chemical mechanical polishing by over coatingUNITED MICROELECTRONICS CORP·Filed 1999·Granted Feb 5, 2002·44 cites·20 claims
- 0975US6293850B1Chemical-mechanical polish machines and fabrication process using the sameUNITED MICROELECTRONICS CORP·Filed 1999·Granted Sep 25, 2001·28 cites·13 claims
- 1075US6183350B1Chemical-mechanical polish machines and fabrication process using the sameUNITED MICROELECTRONICS CORP·Filed 1999·Granted Feb 6, 2001·28 cites·10 claims
- 1175US6169012B1Chemical mechanical polishing for forming a shallow trench isolation structureUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jan 2, 2001·32 cites·6 claims
- 1274US7018906B2Chemical mechanical polishing for forming a shallow trench isolation structureUNITED MICROELECTRONICS CORP·Filed 2004·Granted Mar 28, 2006·10 cites·10 claims
- 1372US6319814B1Method of fabricating dual damasceneUNITED MICROELECTRONICS CORP·Filed 1999·Granted Nov 20, 2001·38 cites·14 claims
- 1472US6048771AShallow trench isolation techniqueUNITED MICROELECTRONICS CORP·Filed 1998·Granted Apr 11, 2000·41 cites·19 claims
- 1571US6319861B1Method of improving depositionUNITED MICROELECTRONICS CORP·Filed 2000·Granted Nov 20, 2001·14 cites·16 claims
- 1671US6239018B1Method for forming dielectric layersUNITED MICROELECTRONICS CORP·Filed 1999·Granted May 29, 2001·29 cites·6 claims
- 1770US6790742B2Chemical mechanical polishing in forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2002·Granted Sep 14, 2004·14 cites·23 claims
- 1868US5959311AStructure of an antenna effect monitorUNITED MICROELECTRONICS CORP·Filed 1998·Granted Sep 28, 1999·34 cites·10 claims
- 1967US6207497B1Conformity of ultra-thin nitride deposition for DRAM capacitorUNITED MICROELECTRONICS CORP·Filed 2000·Granted Mar 27, 2001·11 cites·42 claims
- 2067US6146974AMethod of fabricating shallow trench isolation (STI)UNITED MICROELECTRONICS CORP·Filed 1999·Granted Nov 14, 2000·32 cites·18 claims
- 2167US6099705APhysical vapor deposition device for forming a uniform metal layer on a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 1999·Granted Aug 8, 2000·28 cites·7 claims
- 2265US6562731B2Method for forming dielectric layersUNITED MICROELECTRONICS CORP·Filed 2001·Granted May 13, 2003·7 cites·4 claims
- 2365US6448159B1Chemical mechanical polishing for forming a shallow trench isolation structureUNITED MICROELECTRONICS CORP·Filed 2000·Granted Sep 10, 2002·6 cites·4 claims
- 2465US5958795AChemical-mechanical polishing for shallow trench isolationUNITED MICROELECTRONICS CORP·Filed 1998·Granted Sep 28, 1999·30 cites·7 claims
- 2564US6178543B1Method of designing active region pattern with shift dummy patternUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jan 23, 2001·25 cites·6 claims
- 2664US6174793B1Method for enhancing adhesion between copper and silicon nitrideUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jan 16, 2001·28 cites·20 claims
- 2763US7078346B2High density plasma chemical vapor deposition processUNITED MICROELECTRONICS CORP·Filed 2004·Granted Jul 18, 2006·5 cites·32 claims
- 2861US12275656B2Regenerable nanoparticle for removing manganese and preparatory and use methodsUNIV JIANGSU TECHNOLOGY·Filed 2022·Granted Apr 15, 2025·0 cites·8 claims
- 2961US6214745B1Method of improving surface planarity of chemical-mechanical polishing operation by forming shallow dummy patternUNITED MICROELECTRONICS CORP·Filed 1998·Granted Apr 10, 2001·21 cites·15 claims
- 3060US2023357038A1Method for High-Value Application of PTA Residue High-Concentration Bromine-Containing Wastewater to Preparation of Cuprous BromideUNIV JIANGSU TECHNOLOGY·Filed 2023·Application pending·0 cites
- 3159US6221744B1Method for forming a gateUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 24, 2001·18 cites·5 claims
- 3258US6313028B2Method of fabricating dual damascene structureUNITED MICROELECTRONICS CORP·Filed 1999·Granted Nov 6, 2001·22 cites·20 claims
- 3357US6156642AMethod of fabricating a dual damascene structure in an integrated circuitUNITED MICROELECTRONICS CORP·Filed 1999·Granted Dec 5, 2000·21 cites·16 claims
- 3456US7718079B2High density plasma chemical vapor deposition processUNITED MICROELECTRONICS CORP·Filed 2001·Granted May 18, 2010·3 cites·26 claims
- 3556US6001694AManufacturing method for integrated circuit dielectric layerUNITED MICROELECTRONICS CORP·Filed 1998·Granted Dec 14, 1999·16 cites·12 claims
- 3656US5993647ACirculation system of slurryUNITED MICROELECTRONICS CORP·Filed 1998·Granted Nov 30, 1999·18 cites·10 claims
- 3754US6486040B2Chemical mechanical polishing for forming a shallow trench isolation structureUNITED MICROELECTRONICS CORP·Filed 2001·Granted Nov 26, 2002·2 cites·7 claims
- 3853US6036356AIn-situ slurry mixing apparatusUNITED MICROELECTRONICS CORP·Filed 1998·Granted Mar 14, 2000·17 cites·18 claims
- 3952US6809022B2Method for forming dielectric layersUNITED MICROELECTRONICS CORP·Filed 2003·Granted Oct 26, 2004·2 cites·4 claims
- 4050US7001713B2Method of forming partial reverse active maskUNITED MICROELECTRONICS CORP·Filed 2001·Granted Feb 21, 2006·2 cites·7 claims
- 4150US6255023B1Method of manufacturing binary phase shift maskUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jul 3, 2001·11 cites·21 claims
- 4250US6024106APost-CMP wafer clean processUNITED MICROELECTRONICS CORP·Filed 1998·Granted Feb 15, 2000·14 cites·13 claims
- 4349US6015755AMethod of fabricating a trench isolation structure using a reverse maskUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jan 18, 2000·15 cites·20 claims
- 4448US6627387B2Method of photolithographyUNITED MICROELECTRONICS CORP·Filed 2001·Granted Sep 30, 2003·8 cites·20 claims
- 4545US6261977B1Method for preventing an electrostatic chuck from being corroded during a cleaning processUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jul 17, 2001·11 cites·4 claims
- 4644US6171899B1Method for fabricating a capacitorUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jan 9, 2001·11 cites·38 claims
- 4743US7037802B2Chemical mechanical polishing in forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2004·Granted May 2, 2006·0 cites·32 claims
- 4842US11628238B2Composite membrane comprising a decellularized amniotic membrane and a method for preparing the sameWUHAN KANGCHUANG TECH CO LTD·Filed 2017·Granted Apr 18, 2023·0 cites·19 claims
- 4942US6241582B1Chemical mechanical polish machines and fabrication process using the sameUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jun 5, 2001·6 cites·20 claims
- 5041US12446879B1Magnetic hydrogel, preparation method thereof and non-invasive skin mechanical loading deviceTHE FIRST AFFILIATED HOSPITAL OF XIAN JIAOTONG UNIV·Filed 2025·Granted Oct 21, 2025·0 cites·5 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →