Inventor · disambiguated record
John K. Isenberg
Also filed as: ISENBERG JOHN K · ISENBERG JOHN KARL
14 granted patents·4 pending applications·123 citations·filing 1991–2013
92Inventor score
Top patents by PatentIndex Score
18 records- 0170US7038321B1Method of attaching a flip chip device and circuit assembly formed therebyDELPHI TECH INC·Filed 2005·Granted May 2, 2006·8 cites·10 claims
- 0270US6362435B1Multi-layer conductor pad for reducing solder voidingDELPHI TECH INC·Filed 1999·Granted Mar 26, 2002·38 cites·17 claims
- 0355US9291136B2Fuel injector with a trimmable heater and an increased heater contact areaDELPHI TECH INC·Filed 2013·Granted Mar 22, 2016·0 cites·4 claims
- 0453US5334422AElectrical connector having energy-formed solder stops and methods of making and using the sameDELCO ELECTRONICS CORP·Filed 1993·Granted Aug 2, 1994·20 cites·12 claims
- 0546US6531663B1Solder stop for an electrical connection and method thereforDELPHI TECH INC·Filed 1998·Granted Mar 11, 2003·15 cites·9 claims
- 0645US5910334AMethod of manufacture for a thick film multi-layer circuitDELCO ELECTRONICS CORP·Filed 1997·Granted Jun 8, 1999·12 cites·13 claims
- 0740US6143355APrint alignment method for multiple print thick film circuitsDELPHI TECH INC·Filed 1999·Granted Nov 7, 2000·8 cites·12 claims
- 0840US2013275025A1System and method for controlling a heated fuel injector in an internal combustion engineISENBERG JOHN K·Filed 2012·Application pending·0 cites
- 0939US7294390B2Method for improving the thermal cycled adhesion of thick-film conductors on dielectricDELPHI TECH INC·Filed 2005·Granted Nov 13, 2007·0 cites·4 claims
- 1039US2012048962A1Fuel Injector with a Trimmable Heater and an Increased Heater Contact AreaSHORT JASON C·Filed 2010·Application pending·0 cites
- 1138US2009001546A1Ultra-thick thick film on ceramic substrateFLEDERBACH LYNDA G·Filed 2007·Application pending·0 cites
- 1236US6328914B1Thick-film paste with insoluble additiveDELPHI TECH INC·Filed 1999·Granted Dec 11, 2001·6 cites·14 claims
- 1336US2013036826A1Multiple hydraulic circuit pressure sensorDELPHI TECH INC·Filed 2011·Application pending·0 cites
- 1435US6007867AMethod of manufacturing a thick film circuit with improved dielectric feature definitionDELCO ELECTRONICS CORP·Filed 1998·Granted Dec 28, 1999·4 cites·9 claims
- 1534US6164522AMethod of manufacturing a thick film circuit with constrained adhesive spreadingDELPHI TECH INC·Filed 1999·Granted Dec 26, 2000·4 cites·4 claims
- 1632US5281772AElectrical connector having energy-formed solder stops and methods of making and using the sameDELCO ELECTRONICS CORP·Filed 1991·Granted Jan 25, 1994·5 cites·15 claims
- 1730US5252858ARefractory covercoat for semiconductor devicesDELCO ELECTRONICS CORP·Filed 1991·Granted Oct 12, 1993·2 cites·2 claims
- 1829US5190793ARefractory covercoat for semicondutor devices and methods of making and using the sameDELCO ELECTRONICS CORP·Filed 1992·Granted Mar 2, 1993·1 cites·1 claims
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