Inventor · disambiguated record
Theodore G. Tessier
Also filed as: TESSIER THEODORE G · Tessier Theodore Gerard
11 granted patents·2 pending applications·683 citations·filing 1991–2015
92Inventor score
Top patents by PatentIndex Score
13 records- 0197US5661088AElectronic component and method of packagingMOTOROLA INC·Filed 1996·Granted Aug 26, 1997·175 cites·19 claims
- 0293US5789815AThree dimensional semiconductor package having flexible appendagesMOTOROLA INC·Filed 1996·Granted Aug 4, 1998·167 cites·15 claims
- 0389US5892661ASmartcard and method of makingMOTOROLA INC·Filed 1996·Granted Apr 6, 1999·127 cites·24 claims
- 0484US6022761AMethod for coupling substrates and structureMOTOROLA INC·Filed 1996·Granted Feb 8, 2000·82 cites·19 claims
- 0581US8686556B2Wafer level applied thermal heat sinkFLIPCHIP INT LLC·Filed 2012·Granted Apr 1, 2014·6 cites·16 claims
- 0680US9627254B2Method for building vertical pillar interconnectFLIPCHIP INT LLC·Filed 2013·Granted Apr 18, 2017·7 cites·31 claims
- 0774US5221426ALaser etch-back process for forming a metal feature on a non-metal substrateMOTOROLA INC·Filed 1991·Granted Jun 22, 1993·55 cites·27 claims
- 0872US5217568ASilicon etching process using polymeric mask, for example, to form V-groove for an optical fiber couplingMOTOROLA INC·Filed 1992·Granted Jun 8, 1993·57 cites·15 claims
- 0960US9070747B2Electroplating using dielectric bridgesFLIPCHIP INT LLC·Filed 2013·Granted Jun 30, 2015·1 cites·20 claims
- 1054US7091469B2Packaging for optoelectronic devicesST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Aug 15, 2006·6 cites·20 claims
- 1140US2013093067A1Wafer level applied rf shieldsFLIPCHIP INT LLC·Filed 2012·Application pending·0 cites
- 1234US2011003470A1Methods and structures for a vertical pillar interconnectFLIPCHIP INT LLC·Filed 2010·Application pending·0 cites
- 1327US9831201B2Methods for forming pillar bumps on semiconductor wafersBURGESS GUY F·Filed 2015·Granted Nov 28, 2017·0 cites·25 claims
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