Inventor · disambiguated record
James J. Casto
Also filed as: CASTO JAMES J · CASTO JAMES JOHN
15 granted patents·1,553 citations·filing 1988–2000
96Inventor score
Top patents by PatentIndex Score
15 records- 0198US5172214ALeadless semiconductor device and method for making the sameMOTOROLA INC·Filed 1992·Granted Dec 15, 1992·439 cites·12 claims
- 0295US6772356B1System for specifying core voltage for a microprocessor by selectively outputting one of a first, fixed and a second, variable voltage control settings from the microprocessorADVANCED MICRO DEVICES INC·Filed 2000·Granted Aug 3, 2004·127 cites·36 claims
- 0395US5147815AMethod for fabricating a multichip semiconductor device having two interdigitated leadframesMOTOROLA INC·Filed 1991·Granted Sep 15, 1992·209 cites·12 claims
- 0493US5105259AThermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipationMOTOROLA INC·Filed 1990·Granted Apr 14, 1992·172 cites·15 claims
- 0587US5147821AMethod for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operationMOTOROLA INC·Filed 1991·Granted Sep 15, 1992·103 cites·17 claims
- 0687US5014113AMultiple layer lead frameMOTOROLA INC·Filed 1989·Granted May 7, 1991·74 cites·16 claims
- 0784US6791157B1Integrated circuit package incorporating programmable elementsADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 14, 2004·50 cites·23 claims
- 0884US6732266B1Method and apparatus for reconfiguring circuit board and integrated circuit packet arrangement with one-time programmable elementsADVANCED MICRO DEVICES INC·Filed 2000·Granted May 4, 2004·37 cites·20 claims
- 0984US5498767AMethod for positioning bond pads in a semiconductor die layoutMOTOROLA INC·Filed 1994·Granted Mar 12, 1996·79 cites·23 claims
- 1079US5045914APlastic pad array electronic AC deviceMOTOROLA INC·Filed 1991·Granted Sep 3, 1991·63 cites·17 claims
- 1178US5455200AMethod for making a lead-on-chip semiconductor device having peripheral bond padsMOTOROLA INC·Filed 1993·Granted Oct 3, 1995·56 cites·18 claims
- 1273US6449170B1Integrated circuit package incorporating camouflaged programmable elementsADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 10, 2002·32 cites·18 claims
- 1373US5381036ALead-on chip semiconductor device having peripheral bond padsMOTOROLA INC·Filed 1993·Granted Jan 10, 1995·44 cites·17 claims
- 1468US5060052ATAB bonded semiconductor device having off-chip power and ground distributionMOTOROLA INC·Filed 1990·Granted Oct 22, 1991·41 cites·4 claims
- 1563US4924291AFlagless semiconductor packageMOTOROLA INC·Filed 1988·Granted May 8, 1990·27 cites·19 claims
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