Inventor · disambiguated record
Kouichi Hirosawa
Also filed as: HIROSAWA KOUICHI
2 granted patents·1 pending application·125 citations·filing 1993–2003
69Inventor score
Files withNEC CORP2
Top patents by PatentIndex Score
3 records- 0184US5263243AMethod for producing multilayer printed wiring boardsNEC CORP·Filed 1993·Granted Nov 23, 1993·80 cites·15 claims
- 0274US5578341AMethod of manufacturing printed circuit board by a build-up techniqueNEC CORP·Filed 1994·Granted Nov 26, 1996·45 cites·4 claims
- 0332US2004104463A1Crack resistant interconnect moduleFiled 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →