Inventor · disambiguated record
Jeong Hwan Jeong
Also filed as: JEONG JEONG HWAN
3 granted patents·1 citations·filing 2013–2015
47Inventor score
Technology areasH10P
Top patents by PatentIndex Score
3 records- 0160US10607853B2CMP slurry composition for polishing copper line and polishing method using sameSAMSUNG SDI CO LTD·Filed 2015·Granted Mar 31, 2020·1 cites·9 claims
- 0245US9593260B2CMP slurry composition for polishing copper, and polishing method using sameCHEIL IND INC·Filed 2013·Granted Mar 14, 2017·0 cites·10 claims
- 0341US10150890B2CMP slurry composition for polishing copper and polishing method using the sameSAMSUNG SDI CO LTD·Filed 2015·Granted Dec 11, 2018·0 cites·12 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →