Inventor · disambiguated record
Kanji Otsuka
Also filed as: OTSUKA KANJI
65 granted patents·8 pending applications·2,923 citations·filing 1982–2022
99Inventor score
Top patents by PatentIndex Score
73 records- 0198US4541003ASemiconductor device including an alpha-particle shieldHITACHI LTD·Filed 1982·Granted Sep 10, 1985·235 cites·24 claims
- 0297US7113002B2Transmission cable structure for GHz frequency band signals and connector used for transmission of GHz frequency band signalsFUJIKURA LTD·Filed 2004·Granted Sep 26, 2006·234 cites·20 claims
- 0397US4764804ASemiconductor device and process for producing the sameHITACHI LTD·Filed 1987·Granted Aug 16, 1988·236 cites·5 claims
- 0496US7446567B2Signal transmission apparatus and interconnection structureOTSUKA KANJI·Filed 2004·Granted Nov 4, 2008·199 cites·29 claims
- 0596US5067007ASemiconductor device having leads for mounting to a surface of a printed circuit boardHITACHI LTD·Filed 1991·Granted Nov 19, 1991·360 cites·11 claims
- 0690US5365402ACooling apparatus of electronic deviceHITACHI LTD·Filed 1991·Granted Nov 15, 1994·120 cites·15 claims
- 0790US4447661AProcess for producing an alcohol by hydroformylationNISSAN CHEMICAL IND LTD·Filed 1982·Granted May 8, 1984·37 cites·11 claims
- 0889US6476330B2Wiring substrate and process for producing the sameSANYO ELECTRIC CO·Filed 2000·Granted Nov 5, 2002·39 cites·5 claims
- 0989US5217922AMethod for forming a silicide layer and barrier layer on a semiconductor device rear surfaceHITACHI LTD·Filed 1991·Granted Jun 8, 1993·108 cites·16 claims
- 1089US5188280AMethod of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metalsHITACHI LTD·Filed 1991·Granted Feb 23, 1993·114 cites·31 claims
- 1189US4943843ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Jul 24, 1990·69 cites·38 claims
- 1288US4630095APackaged semiconductor device structure including getter material for decreasing gas from a protective organic coveringVLSI TECHNOLOGY RES ASS·Filed 1984·Granted Dec 16, 1986·78 cites·11 claims
- 1388US4527730AWire bonding apparatusHITACHI LTD·Filed 1983·Granted Jul 9, 1985·68 cites·8 claims
- 1487US6670830B2Driver circuit, receiver circuit, and signal transmission bus systemOTSUKA KANJI·Filed 2001·Granted Dec 30, 2003·53 cites·74 claims
- 1587US5053480APolyimide resin from cyclobutane tetracarboxylic acid dianhydrideNISSAN CHEMICAL IND LTD·Filed 1990·Granted Oct 1, 1991·38 cites·4 claims
- 1686US5195576ALsi cooling apparatus and computer cooling apparatusHITACHI LTD·Filed 1991·Granted Mar 23, 1993·87 cites·5 claims
- 1786US5090609AMethod of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metalsHITACHI LTD·Filed 1990·Granted Feb 25, 1992·98 cites·24 claims
- 1883US7190188B2Signal transmission system, and signal transmission lineROHM CO LTD·Filed 2004·Granted Mar 13, 2007·36 cites·9 claims
- 1982US7511347B2Semiconductor integrated circuit for high-speed, high-frequency signal transmissionELPIDA MEMORY INC·Filed 2005·Granted Mar 31, 2009·9 cites·11 claims
- 2082US5358032ALSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mountedHITACHI LTD·Filed 1993·Granted Oct 25, 1994·73 cites·10 claims
- 2181US5234866ASemiconductor device and process for producing the same, and lead frame used in said processHITACHI LTD·Filed 1992·Granted Aug 10, 1993·44 cites·14 claims
- 2277US7791852B2Electrostatic discharge protection circuit and terminating resistor circuitFUJITSU MICROELECTRONICS LTD·Filed 2007·Granted Sep 7, 2010·7 cites·6 claims
- 2376US4965660AIntegrated circuit package having heat sink bonded with resinous adhesiveHITACHI LTD·Filed 1989·Granted Oct 23, 1990·48 cites·11 claims
- 2475US6522173B1Electronic deviceOTSUKA KANJI·Filed 1999·Granted Feb 18, 2003·40 cites·22 claims
- 2574US8508046B2Circuit substrate and method of manufacturing sameSAKUMA MASAO·Filed 2012·Granted Aug 13, 2013·4 cites·22 claims
- 2673US6630629B2Wiring substrateSANYO ELECTRIC CO·Filed 2002·Granted Oct 7, 2003·14 cites·13 claims
- 2773US5402318ASemiconductor integrated circuit deviceHITACHI LTD·Filed 1993·Granted Mar 28, 1995·56 cites·8 claims
- 2873US5258649ASemiconductor device and electronic apparatus using semiconductor deviceHITACHI LTD·Filed 1992·Granted Nov 2, 1993·48 cites·48 claims
- 2971US7969256B2Signal transmission circuit and signal transmission system with reduced reflectionFUJI XEROX CO LTD·Filed 2008·Granted Jun 28, 2011·4 cites·11 claims
- 3071US6961229B2Electronic circuit deviceROHM CO LTD·Filed 2004·Granted Nov 1, 2005·9 cites·16 claims
- 3171US5107329APin-grid array semiconductor deviceHITACHI LTD·Filed 1989·Granted Apr 21, 1992·38 cites·20 claims
- 3269US6693801B2Electronic deviceOTSUKA KANJI·Filed 2002·Granted Feb 17, 2004·13 cites·9 claims
- 3369US5032895ASemiconductor device and method of producing the sameHITACHI LTD·Filed 1990·Granted Jul 16, 1991·37 cites·13 claims
- 3466US9240237B2Semiconductor device and method of writing/reading entry address into/from semiconductor deviceNAGASE & CO LTD·Filed 2013·Granted Jan 19, 2016·2 cites·9 claims
- 3566US6975489B2Circuit structure and semiconductor integrated circuitRENESAS TECH CORP·Filed 2003·Granted Dec 13, 2005·7 cites·30 claims
- 3666US6373275B1Electronic device capable of greatly improving signal transmission speed in a bus wiring systemOTSUKA KANJI·Filed 1999·Granted Apr 16, 2002·33 cites·26 claims
- 3765US8496044B2Method of manufacturing massive mixture of aluminum nitride and aluminumSEIMIYA YOSHIHIRO·Filed 2009·Granted Jul 30, 2013·3 cites·9 claims
- 3865US6914502B2Wiring structure for transmission line having grooved conductorsROHM CO LTD·Filed 2001·Granted Jul 5, 2005·8 cites·2 claims
- 3965US5126821ASemiconductor device having inner leads extending over a surface of a semiconductor pelletHITACHI LTD·Filed 1990·Granted Jun 30, 1992·25 cites·12 claims
- 4060US7173449B2Signal transmission systemOTSUKA KANJI·Filed 2003·Granted Feb 6, 2007·9 cites·11 claims
- 4160US6625005B2Semiconductor circuit device having power and ground lines adapted for high-frequency operationTOSHIBA KK·Filed 2001·Granted Sep 23, 2003·9 cites·23 claims
- 4258US7906840B2Semiconductor integrated circuit package, printed circuit board, semiconductor apparatus, and power supply wiring structureKYOCERA CORP·Filed 2008·Granted Mar 15, 2011·1 cites·6 claims
- 4358US7280385B2Semiconductor memory deviceROHM CO LTD·Filed 2006·Granted Oct 9, 2007·1 cites·11 claims
- 4458US5309011AWafer scale or full wafer memory system, packaging method thereof, and wafer processing method employed thereinHITACHI LTD·Filed 1992·Granted May 3, 1994·24 cites·25 claims
- 4557US8736074B2Multi chip semiconductor deviceIGUCHI DAISUKE·Filed 2009·Granted May 27, 2014·1 cites·7 claims
- 4657US5018004ASemi-conductor deviceHITACHI LTD·Filed 1989·Granted May 21, 1991·25 cites·18 claims
- 4757US4729010AIntegrated circuit package with low-thermal expansion lead piecesHITACHI LTD·Filed 1986·Granted Mar 1, 1988·23 cites·18 claims
- 4854US8305789B2Memory/logic conjugate systemOTSUKA KANJI·Filed 2010·Granted Nov 6, 2012·1 cites·20 claims
- 4954US2024274571A1Semiconductor substrate assembly and manufacturing method thereforSUGA TADATOMO·Filed 2022·Application pending·0 cites
- 5053US8373072B2Printed circuit boardFUJI XEROX CO LTD·Filed 2009·Granted Feb 12, 2013·0 cites·4 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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