Inventor · disambiguated record
Kunizo Sahara
Also filed as: SAHARA KUNIZO
6 granted patents·849 citations·filing 1987–1992
89Inventor score
Technology areasH10W
Files withHITACHI LTD6
Top patents by PatentIndex Score
6 records- 0197US4764804ASemiconductor device and process for producing the sameHITACHI LTD·Filed 1987·Granted Aug 16, 1988·236 cites·5 claims
- 0296US5067007ASemiconductor device having leads for mounting to a surface of a printed circuit boardHITACHI LTD·Filed 1991·Granted Nov 19, 1991·360 cites·11 claims
- 0389US5188280AMethod of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metalsHITACHI LTD·Filed 1991·Granted Feb 23, 1993·114 cites·31 claims
- 0486US5090609AMethod of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metalsHITACHI LTD·Filed 1990·Granted Feb 25, 1992·98 cites·24 claims
- 0558US5309011AWafer scale or full wafer memory system, packaging method thereof, and wafer processing method employed thereinHITACHI LTD·Filed 1992·Granted May 3, 1994·24 cites·25 claims
- 0650US5191224AWafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed thereinHITACHI LTD·Filed 1990·Granted Mar 2, 1993·17 cites·32 claims
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