Inventor · disambiguated record
Aipeng Shu
Also filed as: SHU AIPENG
3 granted patents·0 citations·filing 2014–2014
40Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0144US9252114B2Semiconductor device grid array packageWANG ZHIJIE·Filed 2014·Granted Feb 2, 2016·0 cites·16 claims
- 0241US9214413B2Semiconductor die package with pre-molded dieWANG ZHIJIE·Filed 2014·Granted Dec 15, 2015·0 cites·17 claims
- 0338US9024427B2Multiple helix substrate and three-dimensional package with sameWANG HUAN·Filed 2014·Granted May 5, 2015·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →