Inventor · disambiguated record
Susumu Sawada
Also filed as: SAWADA SUSUMU
31 granted patents·6 pending applications·384 citations·filing 1975–2018
97Inventor score
Files withPANASONIC IP MAN CO LTD16PANASONIC CORP7JAPAN ENERGY CORP5KITAE TAKASHI2MITSUBISHI CHEM IND2
Top patents by PatentIndex Score
37 records- 0198US9844133B2Flexible substrate including stretchable sheetPANASONIC IP MAN CO LTD·Filed 2016·Granted Dec 12, 2017·29 cites·19 claims
- 0294US10365172B2Tactile sensor that includes two sheets each having at least either flexibility or elasticityPANASONIC IP MAN CO LTD·Filed 2018·Granted Jul 30, 2019·16 cites·14 claims
- 0391US8040200B2Parallel differential transmission lines having an opposing grounding conductor separated into two parts by a slot thereinPANASONIC CORP·Filed 2009·Granted Oct 18, 2011·18 cites·8 claims
- 0491US7537961B2Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the samePANASONIC CORP·Filed 2007·Granted May 26, 2009·18 cites·9 claims
- 0589US10228806B2Flexible touch sensor and method of manufacturing the samePANASONIC IP MAN CO LTD·Filed 2017·Granted Mar 12, 2019·6 cites·18 claims
- 0689US7714444B2Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the samePANASONIC CORP·Filed 2009·Granted May 11, 2010·9 cites·10 claims
- 0789US5456815ASputtering targets of high-purity aluminum or alloy thereofJAPAN ENERGY CORP·Filed 1994·Granted Oct 10, 1995·80 cites·2 claims
- 0881US5487823ASputtering targets having life alarm functionJAPAN ENERGY CORP·Filed 1994·Granted Jan 30, 1996·42 cites·7 claims
- 0978US5772860AHigh purity titanium sputtering targetsJAPAN ENERGY CORP·Filed 1994·Granted Jun 30, 1998·42 cites·18 claims
- 1077US8288778B2Semiconductor device having semiconductor elements formed inside a resin film substrateNAKATANI SEIICHI·Filed 2008·Granted Oct 16, 2012·4 cites·23 claims
- 1172US9236338B2Built-up substrate, method for manufacturing same, and semiconductor integrated circuit packagePANASONIC CORP·Filed 2012·Granted Jan 12, 2016·2 cites·20 claims
- 1272US7919357B2Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substratesPANASONIC CORP·Filed 2009·Granted Apr 5, 2011·5 cites·12 claims
- 1371US8501583B2Method for connecting between substrates, flip-chip mounting structure, and connection structure between substratesKITAE TAKASHI·Filed 2009·Granted Aug 6, 2013·5 cites·11 claims
- 1468US9449944B2Electronic component package and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2013·Granted Sep 20, 2016·2 cites·9 claims
- 1567US9595651B2Electronic component package and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2013·Granted Mar 14, 2017·2 cites·13 claims
- 1666US9825209B2Electronic component package and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2013·Granted Nov 21, 2017·2 cites·14 claims
- 1766US8193526B2Transistor having an organic semiconductor with a hollow spaceNAKATANI SEIICHI·Filed 2008·Granted Jun 5, 2012·2 cites·19 claims
- 1866US4443288AMethod and apparatus for fusing together thermoplastic synthetic resin molded articlesMITSUBISHI CHEM IND·Filed 1982·Granted Apr 17, 1984·19 cites·14 claims
- 1963US5804046AThin-film forming apparatusJAPAN ENERGY CORP·Filed 1994·Granted Sep 8, 1998·41 cites·4 claims
- 2062US9449937B2Semiconductor device and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2013·Granted Sep 20, 2016·1 cites·26 claims
- 2162US9373762B2Electronic part packagePANASONIC IP MAN CO LTD·Filed 2015·Granted Jun 21, 2016·1 cites·7 claims
- 2261US9368469B2Electronic component package and method of manufacturing samePANASONIC IP MAN CO LTD·Filed 2013·Granted Jun 14, 2016·1 cites·17 claims
- 2358US8097958B2Flip chip connection structure having powder-like conductive substance and method of producing the sameSAWADA SUSUMU·Filed 2007·Granted Jan 17, 2012·2 cites·33 claims
- 2457US4032387AWelding apparatusMITSUBISHI CHEM IND·Filed 1975·Granted Jun 28, 1977·18 cites·9 claims
- 2551US4323404AMethod for providing single piece with plural different mechanical characteristicsJAPAN STEEL WORKS LTD·Filed 1980·Granted Apr 6, 1982·12 cites·4 claims
- 2649US9320155B2Ceramic substrate composite and method for manufacturing ceramic substrate compositePANASONIC IP MAN CO LTD·Filed 2012·Granted Apr 19, 2016·0 cites·11 claims
- 2748US9678272B2Flexible optical substratePANASONIC IP MAN CO LTD·Filed 2016·Granted Jun 13, 2017·0 cites·16 claims
- 2848US2009008776A1Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing MethodKITAE TAKASHI·Filed 2007·Application pending·0 cites
- 2945US9627583B2Light-emitting device and method for manufacturing the samePANASONIC CORP·Filed 2013·Granted Apr 18, 2017·0 cites·14 claims
- 3045US9425122B2Electronic component package and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2013·Granted Aug 23, 2016·0 cites·31 claims
- 3145US2018338719A1Biological sensor for obtaining information on living bodyPANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 3243US2015280093A1Light emitting device, method for manufacturing same, and body having light emitting device mounted thereonPANASONIC IP MAN CO LTD·Filed 2013·Application pending·0 cites
- 3342US2015084080A1Light emitting apparatus and method for manufacturing samePANASONIC CORP·Filed 2013·Application pending·0 cites
- 3441US8297488B2Bump forming method using self-assembling resin and a wall surfaceKARASHIMA SEIJI·Filed 2007·Granted Oct 30, 2012·0 cites·20 claims
- 3539US2017090848A1Optical content display systemPANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 3637US2017181276A1Substrate including stretchable sheetPANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 3732US5849417ATitanium implantation materials for the living bodyJAPAN ENERGY CORP·Filed 1995·Granted Dec 15, 1998·5 cites·37 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →