Inventor · disambiguated record
Hartmut Rohrmann
Also filed as: ROHRMANN HARTMUT
6 granted patents·9 pending applications·14 citations·filing 2005–2022
72Inventor score
Top patents by PatentIndex Score
15 records- 0180US9587306B2Method for producing a directional layer by cathode sputtering, and device for implementing the methodROHRMANN HARTMUT·Filed 2008·Granted Mar 7, 2017·12 cites·15 claims
- 0272US11551950B2Substrate processing apparatus and method of processing a substrate and of manufacturing a processed workpieceEVATEC AG·Filed 2018·Granted Jan 10, 2023·2 cites·22 claims
- 0367US11848179B2Methods of and apparatus for magnetron sputteringEVATEC AG·Filed 2022·Granted Dec 19, 2023·0 cites·31 claims
- 0452US2008308412A1Multitarget sputter source and method for the deposition of multi-layersOC OERLIKON BALZERS AG·Filed 2008·Application pending·0 cites
- 0550US11476099B2Methods of and apparatus for magnetron sputteringEVATEC AG·Filed 2018·Granted Oct 18, 2022·0 cites·26 claims
- 0647US11952654B2Liquid sputter targetEVATEC AG·Filed 2019·Granted Apr 9, 2024·0 cites·29 claims
- 0740US2012031749A1Reactive sputtering with multiple sputter sourcesDUBS MARTIN·Filed 2010·Application pending·0 cites
- 0837US8540850B2Target arrangement for mounting / dismounting and method of manufacturingNEUSCH MARCEL·Filed 2006·Granted Sep 24, 2013·0 cites·12 claims
- 0937US2021348274A1Plasma enhanced atomic layer deposition (peald) apparatusEVATEC AG·Filed 2019·Application pending·0 cites
- 1035US2015228530A1Processing arrangement with temperature conditioning arrangement and method of processing a substrateOERLIKON ADVANCED TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 1134US2013180850A1Magnetron sputtering apparatusROHRMANN HARTMUT·Filed 2011·Application pending·0 cites
- 1231US2005205412A1Sputtering device for manufacturing thin filmsROHRMANN HARTMUT·Filed 2005·Application pending·0 cites
- 1330US2006054495A1Substrate processing systemROHRMANN HARTMUT·Filed 2005·Application pending·0 cites
- 1430US2011186421A1Target assembly for a magnetron sputtering apparatus, a magnetron sputtering apparatus and a method of using the magnetron sputtering apparatusOC OERLIKON BALZERS AG·Filed 2011·Application pending·0 cites
- 1526US2019252166A1Sputtering sourceEVATEC AG·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →