Inventor · disambiguated record
Kwanjai Lee
Also filed as: LEE KWANJAI
8 granted patents·2 pending applications·27 citations·filing 2012–2023
81Inventor score
Top patents by PatentIndex Score
10 records- 0192US9177904B2Chip-on-film package and device assembly including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 3, 2015·16 cites·12 claims
- 0285US9818732B2Chip-on-film package and device assembly including the sameJUNG JAE-MIN·Filed 2015·Granted Nov 14, 2017·6 cites·13 claims
- 0380US9241407B2Tape film packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 19, 2016·4 cites·11 claims
- 0472US12191246B2Chip-on-film package having redistribution pattern between semiconductor chip and connection terminalSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 0567US9620389B2Methods of fabricating tape film packagesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 11, 2017·1 cites·10 claims
- 0666US11830803B2Chip-on-film package having redistribution pattern between semiconductor chip and connection terminalSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·19 claims
- 0756US12148337B2Chip on film package with trench to reduce slippage and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 0853US2023176108A1Semiconductor package and method of testing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0944US8940621B2Methods of forming semiconductor modules including flexible panelsHAN SANG-UK·Filed 2012·Granted Jan 27, 2015·0 cites·10 claims
- 1041US2013240917A1Semiconductor package having a conductive layer for electrostatic discharge and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
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