Inventor · disambiguated record
Sangsick Park
Also filed as: PARK SANGSICK
5 granted patents·6 pending applications·2 citations·filing 2020–2024
64Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD11
Top patents by PatentIndex Score
11 records- 0191US12176313B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 24, 2024·2 cites·14 claims
- 0273US2025079378A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0369US11791308B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 0462US11362062B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 14, 2022·0 cites·20 claims
- 0552US2023121888A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0652US2023420336A1Fan-out type semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0751US2024128221A1Semiconductor package including bumps with a plurality of separation distancesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0849US11688707B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·18 claims
- 0949US11469099B2Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·18 claims
- 1049US2024186289A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1149US2024421012A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →