Inventor · disambiguated record
Yasuhiro Teraoka
Also filed as: TERAOKA YASUHIRO
4 granted patents·150 citations·filing 1988–1991
81Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP4
Top patents by PatentIndex Score
4 records- 0179US5157478ATape automated bonding packaged semiconductor device incorporating a heat sinkMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Oct 20, 1992·65 cites·23 claims
- 0265US5166099AManufacturing method for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Nov 24, 1992·39 cites·6 claims
- 0362US5064706ACarrier tape including molten resin flow path element for resin packaged semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Nov 12, 1991·29 cites·1 claims
- 0449US4839713APackage structure for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jun 13, 1989·17 cites·4 claims
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