Inventor · disambiguated record
Chia-Wei Wu
Also filed as: WU CHIA-WEI
46 granted patents·21 pending applications·150 citations·filing 2003–2024
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15MACRONIX INT CO LTD11UNITED MICROELECTRONICS CORP9FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD6XRSPACE CO LTD5
Top patents by PatentIndex Score
67 records- 0195US7811890B2Vertical channel transistor structure and manufacturing method thereofMACRONIX INT CO LTD·Filed 2006·Granted Oct 12, 2010·35 cites·10 claims
- 0294US7224231B2Method for transforming output signals of a low-noise amplifier of a wireless transceiverRICHWAVE TECHNOLOGY CORP·Filed 2005·Granted May 29, 2007·31 cites·2 claims
- 0391US10490556B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 26, 2019·8 cites·9 claims
- 0490US10312106B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 4, 2019·5 cites·20 claims
- 0587US10483108B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 19, 2019·3 cites·20 claims
- 0686US12188686B2Air curtain device and workpiece processing toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·1 cites·20 claims
- 0784US11378882B2Chemical composition for tri-layer removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·1 cites·20 claims
- 0882US7889556B2Flash memory having insulating liners between source/drain lines and channelsMACRONIX INT CO LTD·Filed 2010·Granted Feb 15, 2011·7 cites·6 claims
- 0982US2024282575A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1081US7668010B2Flash memory having insulating liners between source/drain lines and channelsMACRONIX INT CO LTD·Filed 2008·Granted Feb 23, 2010·7 cites·22 claims
- 1180US10608093B2Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 31, 2020·2 cites·10 claims
- 1279US7442620B2Methods for forming a trench isolation structure with rounded corners in a silicon substrateMACRONIX INT CO LTD·Filed 2006·Granted Oct 28, 2008·9 cites·25 claims
- 1379US2024133894A1Biomarkers for early diagnosis and differentiation of mycobacterial infectionWISCONSIN ALUMNI RES FOUND·Filed 2023·Application pending·0 cites
- 1478US12062689B2Manufacturing method of capacitor structureFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 1577US7795088B2Method for manufacturing memory cellMACRONIX INT CO LTD·Filed 2007·Granted Sep 14, 2010·7 cites·16 claims
- 1676US11990339B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 1776US7588443B2Board-to-board electrical connector assemblyHON HAI PREC IND CO LTD·Filed 2007·Granted Sep 15, 2009·17 cites·10 claims
- 1875US11923199B2Method and structure of middle layer removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 1972US10658365B2Semiconductor device and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 19, 2020·1 cites·3 claims
- 2072US2025109870A1Air curtain device and workpiece processing toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2171US11860168B2Biomarkers for early diagnosis and differentiation of mycobacterial infectionWISCONSIN ALUMNI RES FOUND·Filed 2019·Granted Jan 2, 2024·0 cites·10 claims
- 2270US11862666B2Capacitor structure and manufacturing method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·13 claims
- 2370US7629265B2Cleaning method for use in semiconductor device fabricationMACRONIX INT CO LTD·Filed 2006·Granted Dec 8, 2009·3 cites·24 claims
- 2469US11652004B2Methods for forming memory devicesWINBOND ELECTRONICS CORP·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 2569US10817047B2Tracking system and tacking method using the sameXRSPACE CO LTD·Filed 2018·Granted Oct 27, 2020·1 cites·14 claims
- 2667US11398380B2Method and structure of middle layer removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 2767US11081350B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·0 cites·20 claims
- 2867US9246015B2Vertical channel transistor structure and manufacturing method thereofHSU TZU-HSUAN·Filed 2010·Granted Jan 26, 2016·2 cites·6 claims
- 2964US7898274B2Structure of probeNANYA TECHNOLOGY CORP·Filed 2007·Granted Mar 1, 2011·3 cites·3 claims
- 3063US8211806B2Method of fabricating integrated circuit with small pitchWU CHIA-WEI·Filed 2007·Granted Jul 3, 2012·3 cites·13 claims
- 3162US10867803B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 3262US7521321B2Method of fabricating a non-volatile semiconductor memory deviceMACRONIX INT CO LTD·Filed 2007·Granted Apr 21, 2009·2 cites·17 claims
- 3361US11245026B2Memory devicesWINBOND ELECTRONICS CORP·Filed 2019·Granted Feb 8, 2022·0 cites·6 claims
- 3461US9558273B2System and method for generating influencer scoresAPPINIONS INC·Filed 2013·Granted Jan 31, 2017·1 cites·48 claims
- 3560US11502180B2Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Nov 15, 2022·0 cites·6 claims
- 3660US10658179B2Method and structure of middle layer removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·0 cites·20 claims
- 3759US10861855B2Semiconductor device and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 8, 2020·0 cites·11 claims
- 3858US10636798B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 28, 2020·0 cites·11 claims
- 3958US2024421222A1Semiconductor device and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Application pending·0 cites
- 4057US2025248070A1Semiconductor device and manufacturing method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
- 4157US2024194769A1Semiconductor device and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Application pending·0 cites
- 4256US12213303B2Semiconductor device and method of fabricating the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 4356US8466508B2Non-volatile memory structure including stress material between stacked patternsKU SHAW-HUNG·Filed 2007·Granted Jun 18, 2013·1 cites·18 claims
- 4454US10761423B2Chemical composition for tri-layer removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 1, 2020·0 cites·20 claims
- 4554US2022334473A1Chemical Composition for Tri-Layer RemovalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4651US7971177B2Design tool for charge trapping memory using simulated programming operationsMACRONIX INT CO LTD·Filed 2008·Granted Jun 28, 2011·0 cites·20 claims
- 4751US2025139996A1Method of identifying a whiteboard based on image tokensKNERON TAIWAN CO LTD·Filed 2023·Application pending·0 cites
- 4851US2007134708A1Diagnostic targets against Johne's diseaseTALAAT ADEL M·Filed 2006·Application pending·0 cites
- 4950US7776713B2Etching solution, method of surface modification of semiconductor substrate and method of forming shallow trench isolationMACRONIX INT CO LTD·Filed 2007·Granted Aug 17, 2010·0 cites·16 claims
- 5049US10332889B2Method of manufacturing a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 25, 2019·0 cites·10 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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