Inventor · disambiguated record

Chin Jeng Liu

Also filed as: LIU CHIN JENG

1 granted patent·10 citations·filing 2002–2002

32Inventor score

Technology areasH10W

Files withSILICONWARE PRECISION INDUSTRIES CO LTD1

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1 record

0152US6809408B2Semiconductor package with die pad having recessed portionSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Oct 26, 2004·10 cites·13 claims

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