Inventor · disambiguated record
Juhyun Lyu
Also filed as: LYU JUHYUN
5 granted patents·1 pending application·14 citations·filing 2011–2021
71Inventor score
Top patents by PatentIndex Score
6 records- 0188US11114364B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 7, 2021·5 cites·20 claims
- 0285US11569145B2Semiconductor package with thermal interface material for improving package reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·1 cites·20 claims
- 0375US8240541B2Apparatus for mounting semiconductor chipLYU JUHYUN·Filed 2011·Granted Aug 14, 2012·8 cites·11 claims
- 0462US11735494B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 0555US11670565B2Semiconductor package with heat dissipation memberSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 0631US2013167369A1Apparatuses for mounting semiconductor chipsOH JOO-YOUNG·Filed 2012·Application pending·0 cites
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