Inventor · disambiguated record
Satoru Kawai
Also filed as: KAWAI SATORU
69 granted patents·7 pending applications·608 citations·filing 1987–2022
99Inventor score
Top patents by PatentIndex Score
76 records- 0191US4818981AActive matrix display device and method for driving the sameFUJITSU LTD·Filed 1987·Granted Apr 4, 1989·88 cites·20 claims
- 0290US8188380B2Printed wiring board and method for manufacturing printed wiring boardKAWAI SATORU·Filed 2009·Granted May 29, 2012·19 cites·10 claims
- 0388US8686300B2Printed wiring board and method for manufacturing the sameKAWAI SATORU·Filed 2009·Granted Apr 1, 2014·15 cites·16 claims
- 0488US6573964B1Multidomain vertically aligned liquid crystal display deviceFUJITSU DISPLAY TECH·Filed 1999·Granted Jun 3, 2003·82 cites·18 claims
- 0587US6224964B1Thermal transfer sheet, image-printed material and recording methodDAINIPPON PRINTING CO LTD·Filed 1999·Granted May 1, 2001·33 cites·12 claims
- 0685US6303868B1Wire conductor for harnessNGK INSULATORS LTD·Filed 2000·Granted Oct 16, 2001·25 cites·6 claims
- 0785US5795527AMethod of manufacturing decorated article using a transfer materialNISSHA PRINTING·Filed 1994·Granted Aug 18, 1998·65 cites·10 claims
- 0883US8418360B2Method for manufacturing a printed wiring boardKAWAI SATORU·Filed 2011·Granted Apr 16, 2013·5 cites·9 claims
- 0983US8413324B2Method of manufacturing double-sided circuit boardNODA KOTA·Filed 2010·Granted Apr 9, 2013·8 cites·20 claims
- 1082US8679576B2Plating apparatus and method of platingNAKAI TORU·Filed 2008·Granted Mar 25, 2014·2 cites·14 claims
- 1182US7481909B2Plating apparatus, plating method and multilayer printed circuit boardIBIDEN CO LTD·Filed 2005·Granted Jan 27, 2009·7 cites·15 claims
- 1279US10414001B2Galvanometer scannerFANUC CORP·Filed 2018·Granted Sep 17, 2019·1 cites·4 claims
- 1376US6614494B2Repairable thin film transistor matrix substrate and method of repairing the substrateFUJITSU DISPLAY TECH·Filed 2001·Granted Sep 2, 2003·16 cites·6 claims
- 1476US6476881B2Liquid crystal display device and defect repairing method thereforFUJITSU LTD·Filed 2001·Granted Nov 5, 2002·16 cites·5 claims
- 1575US6259494B1Repairable thin film transistor matrix substrate having overlapping regions between auxiliary capacitance electrodes and drain busFUJITSU LTD·Filed 1998·Granted Jul 10, 2001·45 cites·50 claims
- 1673US8552312B2Printed wiring board and method for manufacturing printed wiring boardKAWAI SATORU·Filed 2010·Granted Oct 8, 2013·3 cites·15 claims
- 1773US7897027B2Plating apparatus, plating method and multilayer printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Mar 1, 2011·3 cites·11 claims
- 1871US6882393B2Multidomain vertically aligned liquid crystal display deviceFUJITSU DISPLAY TECH·Filed 2003·Granted Apr 19, 2005·10 cites·2 claims
- 1970US8197659B2Plating apparatus, plating method and multilayer printed circuit boardNAKAI TORU·Filed 2011·Granted Jun 12, 2012·1 cites·11 claims
- 2069US8383956B2Plating apparatus, plating method and multilayer printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Feb 26, 2013·2 cites·13 claims
- 2168US9078343B2Method for manufacturing printed wiring boardYAMAUCHI TSUTOMO·Filed 2011·Granted Jul 7, 2015·5 cites·20 claims
- 2267US11904407B2Laser welding apparatusFANUC CORP·Filed 2020·Granted Feb 20, 2024·0 cites·7 claims
- 2367US10428840B2Blower provided with structure suppressing damage to shaft sealFANUC CORP·Filed 2016·Granted Oct 1, 2019·1 cites·8 claims
- 2466US12058818B2Method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 2565US8766106B2Double-sided circuit board and manufacturing method thereofNODA KOTA·Filed 2012·Granted Jul 1, 2014·1 cites·20 claims
- 2664US6232267B1Thermal transfer sheet and method for manufacturing sameDAINIPPON PRINTING CO LTD·Filed 1998·Granted May 15, 2001·26 cites·1 claims
- 2763US11291118B2Inductor built-in substrateIBIDEN CO LTD·Filed 2021·Granted Mar 29, 2022·0 cites·20 claims
- 2863US11197373B2Inductor built-in substrateIBIDEN CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·20 claims
- 2962US12279368B2Printed wiring boardIBIDEN CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 3062US12027451B2Wiring substrateIBIDEN CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 3161US11272614B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2020·Granted Mar 8, 2022·0 cites·20 claims
- 3260US9416664B2Method of formation of impeller with shape defined by plurality of lines and such impellerFANUC CORP·Filed 2014·Granted Aug 16, 2016·2 cites·2 claims
- 3358US5988762AResin wheel coversTAIHEIYO KOGYO KK·Filed 1997·Granted Nov 23, 1999·20 cites·12 claims
- 3457US12010794B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2022·Granted Jun 11, 2024·0 cites·20 claims
- 3556US12082338B2Printed wiring boardIBIDEN CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 3656US6071596AThermal transfer sheet, image-printed material and recording methodDAINIPPON PRINTING CO LTD·Filed 1999·Granted Jun 6, 2000·8 cites·6 claims
- 3755US12020843B2Inductor built-in substrate and method for manufacturing inductor built-in substrateIBIDEN CO LTD·Filed 2020·Granted Jun 25, 2024·0 cites·20 claims
- 3855US11052491B2Galvano scanner and laser machining systemFANUC CORP·Filed 2018·Granted Jul 6, 2021·0 cites·1 claims
- 3955US9021692B2Method for manufacturing a printed wiring boardKAWAI SATORU·Filed 2011·Granted May 5, 2015·0 cites·20 claims
- 4055US6118545APhotographing boxDAINIPPON PRINTING CO LTD·Filed 1998·Granted Sep 12, 2000·11 cites·12 claims
- 4155US5834154AThermal transfer image-receiving sheetDAINIPPON PRINTING CO LTD·Filed 1996·Granted Nov 10, 1998·10 cites·12 claims
- 4254US11330713B2Printed wiring boardIBIDEN CO LTD·Filed 2021·Granted May 10, 2022·0 cites·20 claims
- 4354US9363891B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Jun 7, 2016·0 cites·20 claims
- 4454US6500700B1Fabrication method of liquid crystal displayFUJITSU LTD·Filed 2000·Granted Dec 31, 2002·6 cites·6 claims
- 4554US6373512B1Photographing boxDAINIPPON PRINTING CO LTD·Filed 2000·Granted Apr 16, 2002·1 cites·1 claims
- 4653US12125626B2Inductor built-in substrateIBIDEN CO LTD·Filed 2020·Granted Oct 22, 2024·0 cites·20 claims
- 4753US11871515B2Wiring substrateIBIDEN CO LTD·Filed 2021·Granted Jan 9, 2024·0 cites·20 claims
- 4853US9402318B2Printed wiring boardIBIDEN CO LTD·Filed 2014·Granted Jul 26, 2016·0 cites·12 claims
- 4953US6379781B1Printed circuit board material and method of manufacturing board material and intermediate block body for board materialNGK INSULATORS LTD·Filed 1999·Granted Apr 30, 2002·15 cites·23 claims
- 5052US11856699B2Inductor built-in substrateIBIDEN CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·20 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
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