Inventor · disambiguated record
Yasukazu Nakata
Also filed as: NAKATA YASUKAZU
14 granted patents·3 pending applications·184 citations·filing 1999–2014
91Inventor score
Top patents by PatentIndex Score
17 records- 0185US7626548B2Antenna circuit, IC inlet and IC tagLINTEC CORP·Filed 2005·Granted Dec 1, 2009·20 cites·6 claims
- 0285US6277481B1Adhesive composition and adhesive sheetLINTEC CORP·Filed 1999·Granted Aug 21, 2001·74 cites·26 claims
- 0379US6853286B2Flat coil component, characteristic adjusting method of flat coil component, ID tag, and characteristic adjusting method of ID tagLINTEC CORP·Filed 2002·Granted Feb 8, 2005·30 cites·12 claims
- 0478US6765289B2Reinforcement material for silicon wafer and process for producing IC chip using said materialLINTEC CORP·Filed 2001·Granted Jul 20, 2004·27 cites·8 claims
- 0568US7812248B2Light transmissible solar cell module, process for manufacturing same, and solar cell panel thereofLINTEC CORP·Filed 2009·Granted Oct 12, 2010·1 cites·5 claims
- 0657US8952371B2Organic EL element and method for manufacturing sameNAKATA MANABU·Filed 2012·Granted Feb 10, 2015·1 cites·6 claims
- 0755US10174234B2Adhesive composition and adhesive sheetLINTEC CORP·Filed 2014·Granted Jan 8, 2019·0 cites·5 claims
- 0855US7804021B2Light transmissible solar cell module, process for manufacturing same, and solar cell panel thereofLINTEC CORP·Filed 2007·Granted Sep 28, 2010·0 cites·7 claims
- 0953US6592973B1Card and process for producing the cardLINTEC CORP·Filed 2000·Granted Jul 15, 2003·6 cites·5 claims
- 1052US6369773B2Sheet antennaLINTEC CORP·Filed 2000·Granted Apr 9, 2002·8 cites·5 claims
- 1149US7294917B2IC tagLINTEC CORP·Filed 2003·Granted Nov 13, 2007·3 cites·7 claims
- 1247US6495752B1Electric wave shielding materialLINTEC CORP·Filed 1999·Granted Dec 17, 2002·12 cites·8 claims
- 1346US7397672B2Flip chip mounting substrateLINTEC CORP·Filed 2004·Granted Jul 8, 2008·2 cites·2 claims
- 1440US2013328038A1Phosphorescent material, process for producing phosphorescent material, and phosphorescent elementTANEDA Masatsugu·Filed 2012·Application pending·0 cites
- 1535US6927099B2Process for producing semiconductor device and semiconductor deviceLINTEC CORP·Filed 2004·Granted Aug 9, 2005·0 cites·13 claims
- 1633US2015228906A1Organic luminescent material, method for producing organic luminescent material and organic luminescent elementUNIV KYUSHU·Filed 2013·Application pending·0 cites
- 1731US2001011575A1Process for producing an IC chip having a protective layerFiled 2000·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →