Inventor · disambiguated record
Tom Hu
Also filed as: HU TOM · HU TOM C · HU TOM CHIH-CHUANG
8 granted patents·1 pending application·199 citations·filing 2001–2021
87Inventor score
Files withAMKOR TECHNOLOGY INC2HU TOM CHIH-CHUANG2YANASAK NATHAN E2HU TOM1MED COLLEGE GEORGIA RES INST1
Top patents by PatentIndex Score
9 records- 0191US6841414B1Saw and etch singulation method for a chip packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Jan 11, 2005·87 cites·16 claims
- 0288US6611047B2Semiconductor package with singulation creaseAMKOR TECHNOLOGY INC·Filed 2001·Granted Aug 26, 2003·58 cites·14 claims
- 0386USD969046SInstrument panel for automobileNISSAN MOTOR·Filed 2021·Granted Nov 8, 2022·15 cites·1 claims
- 0486US8134363B2Test object for use with diffusion MRI and system and method of synthesizing complex diffusive geometries using novel gradient directionsYANASAK NATHAN E·Filed 2008·Granted Mar 13, 2012·19 cites·20 claims
- 0580US7994784B2Systems and methods for rescaling image intensities with diffusion MRI to synthesize complex diffusive geometriesMED COLLEGE GEORGIA RES INST·Filed 2009·Granted Aug 9, 2011·11 cites·15 claims
- 0674US8098068B2Systems and methods for parametric mapping for correction of noise-based systematic bias of DTI metrics, using a DTI mapping phantomYANASAK NATHAN E·Filed 2009·Granted Jan 17, 2012·8 cites·20 claims
- 0766US8738114B2Systems and methods for measuring and modeling in vivo manganese ion transport in a subjectHU TOM CHIH-CHUANG·Filed 2010·Granted May 27, 2014·1 cites·21 claims
- 0854US8728439B2System and method for indirectly measuring calcium ion effluxHU TOM CHIH-CHUANG·Filed 2009·Granted May 20, 2014·0 cites·21 claims
- 0941US2008150132A1Stack up pcb substrate for high density interconnect packagesHU TOM·Filed 2006·Application pending·0 cites
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