Inventor · disambiguated record
Jung Lae Jung
Also filed as: JUNG JUNG LAE
6 granted patents·7 citations·filing 2018–2019
70Inventor score
Files withSAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
6 records- 0186US10410990B2Jig for bonding a semiconductor chip, apparatus for bonding a semiconductor chip including the jig, and method of bonding a semiconductor chip using the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 10, 2019·6 cites·20 claims
- 0263US10748855B2Laminating device and method for fabricating semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 18, 2020·1 cites·14 claims
- 0343US10741430B2Stack boat tool and method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 11, 2020·0 cites·19 claims
- 0441US10900883B2Mold test apparatus and methodSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 26, 2021·0 cites·20 claims
- 0538US10833046B2Stack tool for reflow and stack apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 10, 2020·0 cites·20 claims
- 0637US11244840B2Die ejectors and die supplying apparatuses including ihe sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →