Inventor · disambiguated record
Ching-Ying Lee
Also filed as: LEE CHING-YING
8 granted patents·1 pending application·152 citations·filing 1995–2009
88Inventor score
Top patents by PatentIndex Score
9 records- 0170US5552340ANitridation of titanium, for use with tungsten filled contact holesVANGUARD INT SEMICONDUCT CORP·Filed 1995·Granted Sep 3, 1996·33 cites·25 claims
- 0268US5849640AIn-situ SOG etchback and deposition for IMD processVANGUARD INT SEMICONDUCT CORP·Filed 1996·Granted Dec 15, 1998·38 cites·21 claims
- 0367US5591672AAnnealing of titanium - titanium nitride in contact holeVANGUARD INT SEMICONDUCT CORP·Filed 1995·Granted Jan 7, 1997·38 cites·26 claims
- 0457US2010046162A1Casing, method for manufacturing the same, and electronic device having the samePEGATRON CORP·Filed 2009·Application pending·0 cites
- 0551US6008137APattern formation of silicon nitrideVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Dec 28, 1999·15 cites·9 claims
- 0649US5922622APattern formation of silicon nitrideVANGUARD INT SEMICONDUCT CORP·Filed 1996·Granted Jul 13, 1999·14 cites·10 claims
- 0746US6446252B1Photomask method for making the same capacitor cell area near outmost cell arraysVANGUARD INT SEMICONDUCT CORP·Filed 2000·Granted Sep 3, 2002·1 cites·9 claims
- 0839US5846880AProcess for removing titanium nitride layer in an integrated circuitVANGUARD INT SEMICONDUCT CORP·Filed 1996·Granted Dec 8, 1998·8 cites·16 claims
- 0936US6107201AAluminum spiking inspection methodVANGUARD INT SEMICONDUCT CORP·Filed 1995·Granted Aug 22, 2000·5 cites·15 claims
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