Inventor · disambiguated record
Michael Benedikt
Also filed as: BENEDIKT MICHAEL · BENEDIKT MICHAEL A · BENEDIKT MICHAEL ABRAHAM
10 granted patents·2 pending applications·877 citations·filing 1995–2016
91Inventor score
Files withLUCENT TECHNOLOGIES INC4ALCATEL LUCENT USA INC2BENEDIKT MICHAEL A2HERAEUS DEUTSCHLAND GMBH & CO KG2AT & T CORP1
Top patents by PatentIndex Score
12 records- 0193US6240391B1Method and apparatus for assembling and presenting structured voicemail messagesLUCENT TECHNOLOGIES INC·Filed 1999·Granted May 29, 2001·264 cites·50 claims
- 0292US7716322B2Automatic exploration and testing of dynamic Web sitesALCATEL LUCENT USA INC·Filed 2002·Granted May 11, 2010·106 cites·4 claims
- 0390US6459774B1Structured voicemail messagesLUCENT TECHNOLOGIES INC·Filed 1999·Granted Oct 1, 2002·184 cites·38 claims
- 0490US5966535AMethod and apparatus for generating program code for world wide web service applicationsAT & T CORP·Filed 1995·Granted Oct 12, 1999·190 cites·20 claims
- 0574US6393107B1Method and apparatus for creating and sending structured voicemail messagesLUCENT TECHNOLOGIES INC·Filed 1999·Granted May 21, 2002·70 cites·57 claims
- 0672US6202063B1Methods and apparatus for generating and using safe constraint queriesLUCENT TECHNOLOGIES INC·Filed 1999·Granted Mar 13, 2001·49 cites·9 claims
- 0769US7496571B2Method for performing information-preserving DTD schema embeddingsALCATEL LUCENT USA INC·Filed 2004·Granted Feb 24, 2009·14 cites·10 claims
- 0842US2009089268A1XML Update Facility for an XQuery ProcessorBENEDIKT MICHAEL A·Filed 2007·Application pending·0 cites
- 0941US2005278368A1System and method for XML data integrationBENEDIKT MICHAEL A·Filed 2005·Application pending·0 cites
- 1039US9941197B2Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrateHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2015·Granted Apr 10, 2018·0 cites·13 claims
- 1138US10347566B2Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and useHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2015·Granted Jul 9, 2019·0 cites·17 claims
- 1237US10468569B2Method of producing a connection support, connection support and optoelectronic semiconductor component comprising a connection supportOSRAM GMBH·Filed 2016·Granted Nov 5, 2019·0 cites·18 claims
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