Inventor · disambiguated record
Zafer Kutlu
Also filed as: KUTLU ZAFER · KUTLU ZAFER S
21 granted patents·3 pending applications·484 citations·filing 1998–2021
95Inventor score
Files withLSI LOGIC CORP14ANALOG DEVICES INTERNATIONAL UNLIMITED CO4LSI CORP2ANALOG DEVICES INC1KUTLU ZAFER1
Top patents by PatentIndex Score
24 records- 0196US6472762B1Enhanced laminate flipchip package using a high CTE heatspreaderLSI LOGIC CORP·Filed 2001·Granted Oct 29, 2002·134 cites·20 claims
- 0292US6114761AThermally-enhanced flip chip IC package with extruded heatspreaderLSI LOGIC CORP·Filed 1998·Granted Sep 5, 2000·152 cites·10 claims
- 0389US6590292B1Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfillLSI LOGIC CORP·Filed 2001·Granted Jul 8, 2003·49 cites·9 claims
- 0487US7968999B2Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesiveLSI CORP·Filed 2008·Granted Jun 28, 2011·18 cites·23 claims
- 0582US11955437B2Regulator circuit package techniquesANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2021·Granted Apr 9, 2024·1 cites·19 claims
- 0679US11410977B2Electronic module for high power applicationsANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2019·Granted Aug 9, 2022·3 cites·18 claims
- 0779US11037883B2Regulator circuit package techniquesANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2018·Granted Jun 15, 2021·2 cites·20 claims
- 0879US6111313AIntegrated circuit package having a stiffener dimensioned to receive heat transferred laterally from the integrated circuitLSI LOGIC CORP·Filed 1998·Granted Aug 29, 2000·58 cites·16 claims
- 0977US7528616B2Zero ATE insertion force interposer daughter cardLSI CORP·Filed 2005·Granted May 5, 2009·8 cites·5 claims
- 1073US7096748B2Embedded strain gauge in printed circuit boardsLSI LOGIC CORP·Filed 2004·Granted Aug 29, 2006·19 cites·20 claims
- 1167US6673708B1Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfillLSI LOGIC CORP·Filed 2003·Granted Jan 6, 2004·11 cites·15 claims
- 1267US6639321B1Balanced coefficient of thermal expansion for flip chip ball grid arrayLSI LOGIC CORP·Filed 2000·Granted Oct 28, 2003·13 cites·6 claims
- 1355US7354790B2Method and apparatus for avoiding dicing chip-outs in integrated circuit dieLSI LOGIC CORP·Filed 2005·Granted Apr 8, 2008·2 cites·18 claims
- 1452US11476232B2Three-dimensional packaging techniques for power FET density improvementANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 1552US7190082B2Low stress flip-chip package for low-K silicon technologyLSI LOGIC CORP·Filed 2003·Granted Mar 13, 2007·5 cites·12 claims
- 1648US7479703B1Integrated circuit package with sputtered heat sink for improved thermal performanceLSI LOGIC CORP·Filed 2007·Granted Jan 20, 2009·0 cites·11 claims
- 1748US7345245B2Robust high density substrate design for thermal cycling reliabilityLSI LOGIC CORP·Filed 2003·Granted Mar 18, 2008·3 cites·12 claims
- 1846US6806119B2Method of balanced coefficient of thermal expansion for flip chip ball grid arrayLSI LOGIC CORP·Filed 2003·Granted Oct 19, 2004·2 cites·9 claims
- 1945US6465338B1Method of planarizing die solder balls by employing a die's weightLSI LOGIC CORP·Filed 2000·Granted Oct 15, 2002·1 cites·1 claims
- 2043US11270986B2Package with overhang inductorANALOG DEVICES INC·Filed 2020·Granted Mar 8, 2022·0 cites·22 claims
- 2142US6534968B1Integrated circuit test vehicleLSI LOGIC CORP·Filed 2001·Granted Mar 18, 2003·3 cites·20 claims
- 2242US2008290502A1Integrated circuit package with soldered lid for improved thermal performanceKUTLU ZAFER·Filed 2007·Application pending·0 cites
- 2336US2004070073A1Underfill gap enhancementFiled 2002·Application pending·0 cites
- 2435US2012018901A1Flip-chip package and method of manufacturing the same using ablationVARIOT PATRICK·Filed 2010·Application pending·0 cites
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