Inventor · disambiguated record
Hyun Mo Ku
Also filed as: KU HYUN MO
6 granted patents·1 pending application·13 citations·filing 2015–2022
74Inventor score
Top patents by PatentIndex Score
7 records- 0187US9693445B2Printed circuit board with thermal viaAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Jun 27, 2017·7 cites·21 claims
- 0286US11723143B1Thermal dissipation and shielding improvement using merged PCB bottom copper postAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Aug 8, 2023·1 cites·20 claims
- 0380US9972590B2Semiconductor package having a solder-on-pad structureAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted May 15, 2018·4 cites·20 claims
- 0459US9974181B2Module with external shield and back-spill barrier for protecting contact padsAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted May 15, 2018·1 cites·20 claims
- 0539US9972592B2Bumped land grid arrayAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted May 15, 2018·0 cites·20 claims
- 0637US9907169B1Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCBAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Feb 27, 2018·0 cites·22 claims
- 0732US2016204077A1Method for manufacturing electronic device by using flip-chip bondingAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →