Inventor · disambiguated record
Lynn K. Wiese
Also filed as: WIESE LYNN · WIESE LYNN K · WIESE LYNN KARL
22 granted patents·768 citations·filing 1988–2014
96Inventor score
Files withINFINEON TECHNOLOGIES CORP3Intersil Americas LLC3SIEMENS COMP INC3ANKIREDDI SESHASAYEE S2SIEMENS CORP RES & SUPPORT2
Top patents by PatentIndex Score
22 records- 0197US5775792ALocalized illumination using TIR technologySIEMENS MICROELECTRONICS INC·Filed 1997·Granted Jul 7, 1998·181 cites·22 claims
- 0297US4843280AA modular surface mount component for an electrical device or led'sSIEMENS CORP RES & SUPPORT·Filed 1988·Granted Jun 27, 1989·208 cites·10 claims
- 0390US7540188B2Process condition measuring device with shieldingWIESE LYNN KARL·Filed 2006·Granted Jun 2, 2009·18 cites·11 claims
- 0489US8324602B2Optical sensors that reduce specular reflectionsWIESE LYNN K·Filed 2009·Granted Dec 4, 2012·23 cites·29 claims
- 0588US5785404ALocalized illumination deviceSIEMENS MICROELECTRONICS INC·Filed 1995·Granted Jul 28, 1998·75 cites·32 claims
- 0686USRE36614EModular surface mount component for an electrical device or LED'sINFINEON TECHNOLOGIES CORP·Filed 1998·Granted Mar 14, 2000·77 cites·11 claims
- 0784US4890383AMethod for producing displays and modular componentsSIEMENS CORP RES & SUPPORT·Filed 1989·Granted Jan 2, 1990·57 cites·17 claims
- 0880US7698952B2Pressure sensing deviceKLA TENCOR CORP·Filed 2007·Granted Apr 20, 2010·13 cites·25 claims
- 0980US7555948B2Process condition measuring device with shieldingWIESE LYNN KARL·Filed 2006·Granted Jul 7, 2009·10 cites·9 claims
- 1079US8564012B2Optoelectronic apparatuses and methods for manufacturing optoelectronic apparatusesANKIREDDI SESHASAYEE S·Filed 2012·Granted Oct 22, 2013·6 cites·22 claims
- 1173US8232541B2Optical sensors that reduce specular reflectionsWIESE LYNN K·Filed 2009·Granted Jul 31, 2012·6 cites·29 claims
- 1268US5986317AOptical semiconductor device having plural encapsulating layersINFINEON TECHNOLOGIES CORP·Filed 1995·Granted Nov 16, 1999·35 cites·15 claims
- 1367US8946875B2Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systemsIntersil Americas LLC·Filed 2012·Granted Feb 3, 2015·2 cites·16 claims
- 1466US7223964B2Integration of electronic data storage into a telecommunications componentJDS UNIPHASE CORP·Filed 2003·Granted May 29, 2007·15 cites·7 claims
- 1560US8987658B2Packaged light detector semiconductor devices with non-imaging optical concentrators for ambient light and/or optical proxmity sensing, methods for manufacturing the same, and systems including the sameIntersil Americas LLC·Filed 2012·Granted Mar 24, 2015·1 cites·20 claims
- 1654US9065025B2Optoelectronic apparatuses with post-molded reflector cupsIntersil Americas LLC·Filed 2014·Granted Jun 23, 2015·0 cites·20 claims
- 1751USRE36446EMethod for producing displays and modular componentsINFINEON TECHNOLOGIES CORP·Filed 1998·Granted Dec 14, 1999·15 cites·18 claims
- 1849US5723363AMethod of manufacturing a semiconductor deviceSIEMENS COMP INC·Filed 1995·Granted Mar 3, 1998·15 cites·16 claims
- 1948US8796052B2Optoelectronic apparatuses with post-molded reflector cups and methods for manufacturing the sameANKIREDDI SESHASAYEE S·Filed 2012·Granted Aug 5, 2014·0 cites·14 claims
- 2039US5506425ASemiconductor device and lead frame combinationSIEMENS COMP INC·Filed 1994·Granted Apr 9, 1996·8 cites·7 claims
- 2132US5344794AMethod of making a semiconductor chipSIEMENS COMP INC·Filed 1993·Granted Sep 6, 1994·3 cites·8 claims
- 2229US6987915B1Apparatus and technique for determining placement of optical components in optical communication applicationsMERRICK STEPHEN P·Filed 2004·Granted Jan 17, 2006·0 cites·25 claims
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