Inventor · disambiguated record

Silqun Leung

Also filed as: LEUNG SILQUN

2 granted patents·7 citations·filing 2007–2009

52Inventor score

Technology areasH05K H10W

Files withATI TECHNOLOGIES ULC1 MARTINEZ LIANE1

Top patents by PatentIndex Score

2 records

0167US8012874B2Semiconductor chip substrate with multi-capacitor footprintATI TECHNOLOGIES ULC·Filed 2007·Granted Sep 6, 2011·5 cites·13 claims
0260US9607935B2Semiconductor chip package with undermount passive devicesMARTINEZ LIANE·Filed 2009·Granted Mar 28, 2017·2 cites·18 claims

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