Inventor · disambiguated record
Tung-Han Chuang
Also filed as: CHUANG TUNG-HAN
17 granted patents·13 pending applications·192 citations·filing 1993–2024
92Inventor score
Files withAG MATERIALS TECH CO LTD6NAT SCIENCE COUNCIL4LEE JUN-DER3CHANG SHIH-YING2IND TECH RES INST2
Top patents by PatentIndex Score
30 records- 0194US6207089B1Process for manufacturing an electromagnetic interference shielding metallic foil cladded plastic productNAT SCIENCE COUNCIL·Filed 1998·Granted Mar 27, 2001·58 cites·12 claims
- 0290US11837568B2Bonding structures and methods for forming the sameAG MATERIALS TECH CO LTD·Filed 2021·Granted Dec 5, 2023·2 cites·10 claims
- 0383US6202276B1Process for manufacturing an electromagnetic interference shielding superplastic alloy foil cladded outer shell productFiled 1999·Granted Mar 20, 2001·54 cites·16 claims
- 0480US8940403B2Alloy wire and methods for manufacturing the sameLEE JUN-DER·Filed 2012·Granted Jan 27, 2015·7 cites·19 claims
- 0579US8742600B2Dual-phase intermetallic interconnection structure and method of fabricating the sameIND TECH RES INST·Filed 2013·Granted Jun 3, 2014·5 cites·17 claims
- 0664US6182486B1Superplastic alloy-containing conductive plastic article for shielding electromagnetic interference and process for manufacturing the sameNAT SCIENCE COUNCIL·Filed 1998·Granted Feb 6, 2001·24 cites·19 claims
- 0761US9425168B2Stud bump and package structure thereof and method of manufacturing the sameWIRE TECH CO LTD·Filed 2014·Granted Aug 23, 2016·2 cites·11 claims
- 0860US5449109AMethod for superplastic forming by internal pressureFiled 1993·Granted Sep 12, 1995·18 cites·10 claims
- 0958US12148725B2Bonding structures and methods for forming the sameAG MATERIALS TECH CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 1057US12191274B2Nano-twinned structure on metallic thin film surface and method for forming the sameAG MATERIALS TECH CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·5 claims
- 1157US2022388092A1Methods for forming bonding structuresUNIV NAT TAIWAN·Filed 2022·Application pending·0 cites
- 1255US2023057312A1Metallic nano-twinned thin film structure and method for forming the sameAG MATERIALS TECH CO LTD·Filed 2021·Application pending·0 cites
- 1354US9048388B2Multi-layer thermoelectric module and method for fabricating the sameCHINA STEEL CORP·Filed 2013·Granted Jun 2, 2015·1 cites·6 claims
- 1454US8288280B2Conductor removal processHUNG YUNG-TAI·Filed 2007·Granted Oct 16, 2012·1 cites·10 claims
- 1553US2025385211A1Package structure and packaging methodSUREWAY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1653US2025385155A1Package structure and method of forming the sameSUREWAY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1752US2025140733A1Die bonding structure and method of manufacturing the sameAG MATERIALS TECH CO LTD·Filed 2024·Application pending·0 cites
- 1850US2013323530A1Active solderUNIV NAT YUNLIN SCI & TECH·Filed 2013·Application pending·0 cites
- 1947US5531851AProcess for making metallized plastic molding pellets for shielding electromagnetic interferenceFiled 1995·Granted Jul 2, 1996·12 cites·8 claims
- 2047US2022336407A1Die bonding structures and method for forming the sameAG MATERIALS TECH CO LTD·Filed 2021·Application pending·0 cites
- 2142US9490147B2Stud bump structure and method for manufacturing the sameWIRE TECH CO LTD·Filed 2013·Granted Nov 8, 2016·0 cites·13 claims
- 2240US2014175495A1Die bonding method and die bonding structure of light emitting diode packageIND TECH RES INST·Filed 2013·Application pending·0 cites
- 2339US2013029178A1Active solderCHANG SHIH-YING·Filed 2011·Application pending·0 cites
- 2439US2013152990A1Solid-liquid interdiffusion bonding structure of thermoelectric module and fabricating method thereofLAI HONG-JEN·Filed 2012·Application pending·0 cites
- 2538US2013233594A1Composite wire of silver-gold-palladium alloy coated with metal thin film and method thereofLEE JUN DER·Filed 2013·Application pending·0 cites
- 2638US2013233593A1Composite wire of silver-palladium alloy coated with metallic thin film and method thereofLEE JUN-DER·Filed 2013·Application pending·0 cites
- 2734US9997488B2Copper-based alloy wire and methods for manufaturing the sameCHUANG TUNG HAN·Filed 2014·Granted Jun 12, 2018·0 cites·16 claims
- 2830US6210521B1Process and apparatus for making radially arranged aluminum foil-filled plastic pellets to shield against electromagnetic interferenceNAT SCIENCE COUNCIL·Filed 1998·Granted Apr 3, 2001·4 cites·15 claims
- 2930US2006021734A1Heat sink and heat spreader bonding structureCHANG SHIH-YING·Filed 2004·Application pending·0 cites
- 3029US5746956AProcess and apparatus for manufacturing aluminum laminally filled plastic pellets for shielding electromagnetic interferenceNAT SCIENCE COUNCIL·Filed 1996·Granted May 5, 1998·4 cites·27 claims
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