Inventor · disambiguated record
Masatoshi Yasunaga
Also filed as: YASUNAGA MASATOSHI
29 granted patents·2 pending applications·1,011 citations·filing 1990–2020
97Inventor score
Files withMITSUBISHI ELECTRIC CORP16RENESAS ELECTRONICS CORP6KURODA SOSHI2RENESAS TECH CORP2DIAMOND&ZEBRA ELECTRIC MFG CO LTD1
Top patents by PatentIndex Score
31 records- 0196US5018003ALead frame and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1990·Granted May 21, 1991·218 cites·2 claims
- 0295US5656863AResin seal semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Aug 12, 1997·183 cites·24 claims
- 0393US5217910AMethod of fabricating semiconductor device having sidewall spacers and oblique implantationMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Jun 8, 1993·199 cites·20 claims
- 0486US6191493B1Resin seal semiconductor package and manufacturing method of the sameMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Feb 20, 2001·67 cites·6 claims
- 0585US6768516B2Semiconductor device constituting a CMOS camera systemRENESAS TECH CORP·Filed 2000·Granted Jul 27, 2004·42 cites·19 claims
- 0682US6544814B1Method of manufacturing a packaged semiconductor device, and a semiconductor device manufactured therebyMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 8, 2003·34 cites·12 claims
- 0779US8772952B2Semiconductor device with copper wire having different width portionsYASUNAGA MASATOSHI·Filed 2010·Granted Jul 8, 2014·7 cites·11 claims
- 0878US6256875B1Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jul 10, 2001·50 cites·8 claims
- 0976US6469395B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 22, 2002·26 cites·8 claims
- 1075US6476502B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Nov 5, 2002·23 cites·20 claims
- 1169US9087816B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Jul 21, 2015·2 cites·10 claims
- 1269US5753973AResin seal semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 1997·Granted May 19, 1998·28 cites·25 claims
- 1368US6462425B1Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Oct 8, 2002·36 cites·14 claims
- 1466US6005289APackage for semiconductor device laminated printed circuit boardsMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Dec 21, 1999·30 cites·5 claims
- 1565US9589923B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Mar 7, 2017·1 cites·18 claims
- 1665US8605277B2Method of inspecting semiconductor deviceYAMADA SATOSHI·Filed 2011·Granted Dec 10, 2013·2 cites·11 claims
- 1763US9130062B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 8, 2015·1 cites·19 claims
- 1863US5096853AMethod for manufacturing a resin encapsulated semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Mar 17, 1992·29 cites·1 claims
- 1962US9024454B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted May 5, 2015·1 cites·13 claims
- 2056US8334172B2Manufacturing method of semiconductor deviceKURODA SOSHI·Filed 2011·Granted Dec 18, 2012·1 cites·22 claims
- 2153US10050011B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Aug 14, 2018·0 cites·13 claims
- 2252US5920770AResin seal semiconductor package and manufacturing method of the sameMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Jul 6, 1999·13 cites·27 claims
- 2344US6856028B1Semiconductor device having an improved mounting structureRENESAS TECH CORP·Filed 2000·Granted Feb 15, 2005·1 cites·4 claims
- 2443US8692383B2Semiconductor device and method of manufacturing the sameKURODA SOSHI·Filed 2011·Granted Apr 8, 2014·0 cites·13 claims
- 2543US8629002B2Manufacturing method of semiconductor deviceRENESAS ELECTRIC CORP·Filed 2012·Granted Jan 14, 2014·0 cites·5 claims
- 2641US12155180B2IgniterDIAMOND&ZEBRA ELECTRIC MFG CO LTD·Filed 2020·Granted Nov 26, 2024·0 cites·6 claims
- 2736US8293575B2Manufacturing method of semiconductor deviceHIRAI TATSUYA·Filed 2010·Granted Oct 23, 2012·0 cites·11 claims
- 2836US5075240ASemiconductor device manufactured by using conductive ion implantation maskMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Dec 24, 1991·8 cites·10 claims
- 2936US2010320623A1Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 3036US2003011053A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 3134US5296710AInfrared radiation detectorMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Mar 22, 1994·9 cites·14 claims
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