Inventor · disambiguated record
Daniel Porwol
Also filed as: PORWOL DANIEL
17 granted patents·2 pending applications·50 citations·filing 2007–2024
90Inventor score
Top patents by PatentIndex Score
19 records- 0194US7943423B2Reconfigured wafer alignmentINFINEON TECHNOLOGIES AG·Filed 2009·Granted May 17, 2011·28 cites·24 claims
- 0281US9981843B2Chip package and a method of producing the sameINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 29, 2018·2 cites·20 claims
- 0381US9455160B2Method for fabricating a semiconductor chip panelINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 27, 2016·4 cites·12 claims
- 0479US2025029884A1Method of Manufacturing a Package Having an Electronic Component and an Encapsulant Encapsulating a Dielectric Layer and a Semiconductor Die of the Electronic ComponentINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0578US12112992B2Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic componentINFINEON TECHNOLOGIES AG·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 0673US8173488B2Electronic device and method of manufacturing sameBAUER MICHAEL·Filed 2008·Granted May 8, 2012·6 cites·16 claims
- 0772US10483133B2Method for fabricating a semiconductor chip panelINFINEON TECHNOLOGIES AG·Filed 2018·Granted Nov 19, 2019·1 cites·20 claims
- 0872US8158046B2Mold apparatus and methodBRUNNBAUER MARKUS·Filed 2007·Granted Apr 17, 2012·4 cites·11 claims
- 0971US11605572B2Electronic component with semiconductor die having a low ohmic portion with an active area and a high ohmic portion on a dielectric layerINFINEON TECHNOLOGIES AG·Filed 2021·Granted Mar 14, 2023·0 cites·23 claims
- 1068US10332814B2Bonded system and a method for adhesively bonding a hygroscopic materialINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 25, 2019·2 cites·18 claims
- 1168US9953846B2Method for fabricating a semiconductor chip panelINFINEON TECHNOLOGIES AG·Filed 2016·Granted Apr 24, 2018·1 cites·11 claims
- 1267US8906749B2Method for fabricating a semiconductor deviceBAUER MICHAEL·Filed 2012·Granted Dec 9, 2014·2 cites·18 claims
- 1356US10600690B2Method for handling a product substrate and a bonded substrate systemINFINEON TECHNOLOGIES AG·Filed 2018·Granted Mar 24, 2020·0 cites·17 claims
- 1451US10694584B2Infrared emitter arrangement and method for producing an infrared emitter arrangementINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 23, 2020·0 cites·24 claims
- 1551US9988262B2Temporary mechanical stabilization of semiconductor cavitiesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 5, 2018·0 cites·20 claims
- 1651US8394308B2Mold methodBRUNNBAUER MARKUS·Filed 2012·Granted Mar 12, 2013·0 cites·7 claims
- 1748US10056295B2Method for handling a product substrate, a bonded substrate system and a temporary adhesiveINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 21, 2018·0 cites·11 claims
- 1843US11279120B2Device and method for debonding a structure from a main surface region of a carrierINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 22, 2022·0 cites·14 claims
- 1932US2016155680A1Semiconductor Package and Method of Fabrication ThereofINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
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