Inventor · disambiguated record
Barry M. Miles
Also filed as: MILES BARRY M · MILES BARRY MICHAEL
18 granted patents·2,199 citations·filing 1989–2007
97Inventor score
Top patents by PatentIndex Score
18 records- 0198US5535101ALeadless integrated circuit packageMOTOROLA INC·Filed 1992·Granted Jul 9, 1996·351 cites·8 claims
- 0297US6201305B1Making solder ball mounting pads on substratesAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 13, 2001·245 cites·18 claims
- 0397US4940181APad grid array for receiving a solder bumped chip carrierMOTOROLA INC·Filed 1989·Granted Jul 10, 1990·193 cites·19 claims
- 0495US5696666ALow profile exposed die chip carrier packageMOTOROLA INC·Filed 1995·Granted Dec 9, 1997·304 cites·15 claims
- 0595US5166772ATransfer molded semiconductor device package with integral shieldMOTOROLA INC·Filed 1991·Granted Nov 24, 1992·281 cites·10 claims
- 0695US5019673AFlip-chip package for integrated circuitsMOTOROLA INC·Filed 1990·Granted May 28, 1991·211 cites·2 claims
- 0794US5006673AFabrication of pad array carriers from a universal interconnect structureMOTOROLA INC·Filed 1989·Granted Apr 9, 1991·130 cites·20 claims
- 0890US5831832AMolded plastic ball grid array packageMOTOROLA INC·Filed 1997·Granted Nov 3, 1998·78 cites·18 claims
- 0983US5721450AMoisture relief for chip carriersMOTOROLA INC·Filed 1995·Granted Feb 24, 1998·73 cites·20 claims
- 1082US6242802B1Moisture enhanced ball grid array packageMOTOROLA INC·Filed 1995·Granted Jun 5, 2001·72 cites·5 claims
- 1181US5031027AShielded electrical circuitMOTOROLA INC·Filed 1990·Granted Jul 9, 1991·49 cites·16 claims
- 1279US5296738AMoisture relief for chip carrierMOTOROLA INC·Filed 1992·Granted Mar 22, 1994·61 cites·12 claims
- 1379US5153385ATransfer molded semiconductor package with improved adhesionMOTOROLA INC·Filed 1991·Granted Oct 6, 1992·62 cites·15 claims
- 1475US5077633AGrounding an ultra high density pad array chip carrierMOTOROLA INC·Filed 1989·Granted Dec 31, 1991·42 cites·11 claims
- 1565US9367712B1High density memory card using folded flexSMITH LEE J·Filed 2007·Granted Jun 14, 2016·3 cites·20 claims
- 1656US5515188AMethod of manufacturing a liquid crystal display device in which a vacuum reservoir attached to the LCD is placed in a conformable container or bagMOTOROLA INC·Filed 1994·Granted May 7, 1996·17 cites·7 claims
- 1754US5134462AFlexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrateMOTOROLA INC·Filed 1991·Granted Jul 28, 1992·22 cites·24 claims
- 1838US5198264AMethod for adhering polyimide to a substrateMOTOROLA INC·Filed 1990·Granted Mar 30, 1993·5 cites·4 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →