Inventor · disambiguated record
Jian-Hong Chen
Also filed as: CHEN JIAN · CHEN JIAN-HONG
47 granted patents·10 pending applications·534 citations·filing 1993–2023
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG19IND TECH RES INST9TENCENT TECH SHENZHEN CO LTD4XINTEC INC3CRRC QINGDAO SIFANG CO LTD2
Top patents by PatentIndex Score
57 records- 0195US8460856B2Material and method for photolithographyYEH HSIAO-WEI·Filed 2011·Granted Jun 11, 2013·35 cites·18 claims
- 0294US7524607B2Water soluble negative tone photoresistTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Apr 28, 2009·28 cites·4 claims
- 0391US8533558B2System and method of error correction of control data at a memory deviceYURZOLA DAMIAN PABLO·Filed 2010·Granted Sep 10, 2013·18 cites·21 claims
- 0490US7235348B2Water soluble negative tone photoresistTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 26, 2007·38 cites·33 claims
- 0590US6905621B2Method for preventing the etch transfer of sidelobes in contact hole patternsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 14, 2005·52 cites·36 claims
- 0689US6488509B1Plug filling for dual-damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 3, 2002·49 cites·45 claims
- 0787US8595861B2Thermal probeLIU BERNARD HAOCHIH·Filed 2012·Granted Nov 26, 2013·12 cites·10 claims
- 0884US7117058B2Automatic statistical process control (SPC) chart generation apparatus and method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 3, 2006·55 cites·24 claims
- 0983US9560617B2Wireless network access method and apparatus, terminal, and serverTENCENT TECH SHENZHEN CO LTD·Filed 2016·Granted Jan 31, 2017·6 cites·18 claims
- 1083US8578511B2Thermal probeLIU BERNARD HAOCHIH·Filed 2012·Granted Nov 5, 2013·8 cites·10 claims
- 1183US6900134B1Method for forming openings in a substrate using bottom antireflective coatingsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 31, 2005·28 cites·21 claims
- 1282US11254566B2Preparation method of bionic adhesive material with tip-expanded microstructural arrayUNIV NANJING AERONAUTICS & ASTRONAUTICS·Filed 2020·Granted Feb 22, 2022·2 cites·6 claims
- 1382US8450052B2Double patterning strategy for contact hole and trench in photolithographyHSU FENG-CHENG·Filed 2011·Granted May 28, 2013·6 cites·20 claims
- 1482US7419771B2Method for forming a finely patterned resistTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 2, 2008·6 cites·21 claims
- 1579US11942563B1Manufacturing method of chip package and chip packageXINTEC INC·Filed 2023·Granted Mar 26, 2024·0 cites·10 claims
- 1679US7033735B2Water soluble negative tone photoresistTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Apr 25, 2006·16 cites·39 claims
- 1776US8158335B2High etch resistant material for double patterningYEH HSIAO-WEI·Filed 2008·Granted Apr 17, 2012·6 cites·17 claims
- 1874US10529384B2Video recording method and apparatus for mobile terminalTENCENT TECH SHENZHEN CO LTD·Filed 2017·Granted Jan 7, 2020·2 cites·19 claims
- 1974US5516879ACatalytic compositions for the preparation of poly(butylene terephthalate)IND TECH RES INST·Filed 1995·Granted May 14, 1996·27 cites·15 claims
- 2073US8048616B2Double patterning strategy for contact hole and trench in photolithographyTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 1, 2011·3 cites·20 claims
- 2173US7452822B2Via plug formation in dual damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 18, 2008·6 cites·23 claims
- 2273US6303725B1Cyclic dione polymerIND TECH RES INST·Filed 2000·Granted Oct 16, 2001·11 cites·14 claims
- 2371US11705368B2Manufacturing method of chip package and chip packageXINTEC INC·Filed 2021·Granted Jul 18, 2023·0 cites·4 claims
- 2470US5555525AMethod of making graded refractive index polymeric optical fibers and optical fibers made by the methodIND TECH RES INST·Filed 1994·Granted Sep 10, 1996·31 cites·18 claims
- 2568US7749904B2Method of forming a dual damascene structureTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 6, 2010·4 cites·6 claims
- 2667US5434277AImproved metallic soaps of fatty acids for use as photolyzing agents for photodegradable polymer filmsIND TECH RES INST·Filed 1993·Granted Jul 18, 1995·11 cites·13 claims
- 2765US7972957B2Method of making openings in a layer of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jul 5, 2011·2 cites·15 claims
- 2864US6396460B2Chip antennaIND TECH RES INST·Filed 2001·Granted May 28, 2002·16 cites·23 claims
- 2963US11121031B2Manufacturing method of chip package and chip packageXINTEC INC·Filed 2019·Granted Sep 14, 2021·0 cites·8 claims
- 3063US7241682B2Method of forming a dual damascene structureTAIWAN SEMINCONDUCTOR MFG CO L·Filed 2004·Granted Jul 10, 2007·11 cites·15 claims
- 3162US7254513B2Fault detection and classification (FDC) specification management apparatus and method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 7, 2007·11 cites·18 claims
- 3259US10796726B2Video recording method and apparatus for mobile terminalTENCENT TECH SHENZHEN CO LTD·Filed 2019·Granted Oct 6, 2020·0 cites·20 claims
- 3359US6207779B1Ring-opened polymerIND TECH RES INST·Filed 1998·Granted Mar 27, 2001·17 cites·44 claims
- 3459US2024186764A1Spacer for attaching coefficient of thermal expansion mismatched componentsLUMENTUM OPERATIONS LLC·Filed 2021·Application pending·0 cites
- 3554US6573024B2Ammonium salt of organic acid and resist composition containing the sameIND TECH RES INST·Filed 2001·Granted Jun 3, 2003·2 cites·18 claims
- 3653US12163863B2Detection system for suspension system of maglev trainCRRC QINGDAO SIFANG CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·10 claims
- 3753US8029969B2Material and method for photolithographyTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Oct 4, 2011·0 cites·19 claims
- 3852US6538086B1Polymer with a pericyclic protective group and resist composition containing the sameIND TECH RES INST·Filed 2000·Granted Mar 25, 2003·2 cites·2 claims
- 3951US7253112B2Dual damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 7, 2007·5 cites·20 claims
- 4051US2009184081A1Temperature-sensing feeding bottle structureWU MING-JUNG·Filed 2008·Application pending·0 cites
- 4147US2010209852A1Track nozzle system for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2009·Application pending·0 cites
- 4246US12074116B2Integrated package structureJCET GROUP CO LTD·Filed 2020·Granted Aug 27, 2024·0 cites·14 claims
- 4345US2008156346A1Method and apparatus for cleaning a substrateTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 4444US12249582B2SIP package structureJCET GROUP CO LTD·Filed 2020·Granted Mar 11, 2025·0 cites·16 claims
- 4544US11982589B2Magnetic levitation test system and electromagnet test methodCRRC QINGDAO SIFANG CO LTD·Filed 2019·Granted May 14, 2024·0 cites·7 claims
- 4643US7094686B2Contact hole printing by packing and unpackingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 22, 2006·2 cites·15 claims
- 4743US2023000111A1Method for feeding Hermetia illucens and used as for preparing composite material of pupariumsSICHUAN ZHIXIANGYI TECH CO LTD·Filed 2020·Application pending·0 cites
- 4839US8966073B2Network communication method and systemTENCENT TECH SHENZHEN CO LTD·Filed 2013·Granted Feb 24, 2015·0 cites·3 claims
- 4939US8224142B2Nano/micro-patterned optical device and fabrication method thereofWANG LON·Filed 2009·Granted Jul 17, 2012·0 cites·20 claims
- 5038US8296634B2Error correction decoder, error correction value generator, and error correction systemCHANG YAO-TSU·Filed 2010·Granted Oct 23, 2012·2 cites·24 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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