Inventor · disambiguated record
Muneo Miura
Also filed as: MIURA MUNEO
3 granted patents·1 pending application·8 citations·filing 2005–2015
61Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0165US7439101B2Resin encapsulation molding method for semiconductor deviceTOWA CORP·Filed 2005·Granted Oct 21, 2008·5 cites·4 claims
- 0262US9728426B2Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like memberTOWA CORP·Filed 2014·Granted Aug 8, 2017·2 cites·3 claims
- 0357US9580827B2Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like memberTOWA CORP·Filed 2015·Granted Feb 28, 2017·1 cites·45 claims
- 0435US2008213947A1Resin encapsulation molding method for semiconductor deviceSHIMONAKA TOMOYA·Filed 2008·Application pending·0 cites
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