Inventor · disambiguated record
Kozo Yamasaki
Also filed as: YAMASAKI KOZO
20 granted patents·347 citations·filing 1990–2008
96Inventor score
Files withNGK SPARK PLUG CO20
Top patents by PatentIndex Score
20 records- 0188US7936567B2Wiring board with built-in component and method for manufacturing the sameNGK SPARK PLUG CO·Filed 2008·Granted May 3, 2011·26 cites·4 claims
- 0286US6080936AConnecting board with oval-shaped protrusionsNGK SPARK PLUG CO·Filed 1997·Granted Jun 27, 2000·57 cites·4 claims
- 0379US6976415B2Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panelNGK SPARK PLUG CO·Filed 2005·Granted Dec 20, 2005·7 cites·11 claims
- 0475US6674017B1Multilayer-wiring substrate and method for fabricating sameNGK SPARK PLUG CO·Filed 1999·Granted Jan 6, 2004·42 cites·14 claims
- 0573US6148900AConnecting board for connection between base plate and mounting boardNGK SPARK PLUG CO·Filed 1998·Granted Nov 21, 2000·31 cites·14 claims
- 0664US6872436B2Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panelNGK SPARK PLUG CO·Filed 2003·Granted Mar 29, 2005·9 cites·6 claims
- 0764US5859407AConnecting board for connection between base plate and mounting boardNGK SPARK PLUG CO·Filed 1997·Granted Jan 12, 1999·30 cites·17 claims
- 0861US6224703B1Method of making laminate ceramic substrate with domed padsNGK SPARK PLUG CO·Filed 1999·Granted May 1, 2001·23 cites·18 claims
- 0961US6018197AWired board with improved bonding padsNGK SPARK PLUG CO·Filed 1997·Granted Jan 25, 2000·25 cites·6 claims
- 1056US5621190ACeramic package main bodyNGK SPARK PLUG CO·Filed 1994·Granted Apr 15, 1997·19 cites·13 claims
- 1153US5099388AAlumina multilayer wiring substrate provided with high dielectric material layerNGK SPARK PLUG CO·Filed 1990·Granted Mar 24, 1992·24 cites·12 claims
- 1247US6115913AConnecting boardNGK SPARK PLUG CO·Filed 1999·Granted Sep 12, 2000·12 cites·10 claims
- 1343US6139904AMethod of making a printed boardNGK SPARK PLUG CO·Filed 1999·Granted Oct 31, 2000·12 cites·23 claims
- 1441US5545598AHigh heat conductive body and wiring base substrate fitted with the sameNGK SPARK PLUG CO·Filed 1994·Granted Aug 13, 1996·11 cites·8 claims
- 1540USD423532SSolder column interposerNGK SPARK PLUG CO·Filed 1998·Granted Apr 25, 2000·3 cites·1 claims
- 1638US6077728AMethod of producing a ceramic package main bodyNGK SPARK PLUG CO·Filed 1998·Granted Jun 20, 2000·6 cites·10 claims
- 1733USD423027SSolder ball interposerNGK SPARK PLUG CO·Filed 1998·Granted Apr 18, 2000·1 cites·1 claims
- 1833US5822851AMethod of producing a ceramic package main bodyNGK SPARK PLUG CO·Filed 1996·Granted Oct 20, 1998·3 cites·11 claims
- 1931USD423533SSolder ball interposerNGK SPARK PLUG CO·Filed 1998·Granted Apr 25, 2000·0 cites·1 claims
- 2029US5060049AMultiple resistivity wiring apparatusNGK SPARK PLUG CO·Filed 1990·Granted Oct 22, 1991·6 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →