Inventor · disambiguated record
Bipin Dama
Also filed as: DAMA BIPIN · DAMA BIPIN D
23 granted patents·10 pending applications·185 citations·filing 2005–2023
95Inventor score
Top patents by PatentIndex Score
33 records- 0196US7483597B2Optical modulator utilizing multi-level signalingLIGHTWIRE INC·Filed 2007·Granted Jan 27, 2009·38 cites·8 claims
- 0293US10209464B2Direct printed circuit routing to stacked opto-electrical IC packagesCISCO TECH INC·Filed 2014·Granted Feb 19, 2019·19 cites·17 claims
- 0393US8803269B2Wafer scale packaging platform for transceiversSHASTRI KALPENDU·Filed 2012·Granted Aug 12, 2014·21 cites·18 claims
- 0492US8905632B2Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic componentsCISCO TECH INC·Filed 2012·Granted Dec 9, 2014·11 cites·20 claims
- 0592US8340529B2HDMI TMDS optical signal transmission using PAM techniqueSHASTRI KALPENDU·Filed 2010·Granted Dec 25, 2012·12 cites·6 claims
- 0690US10725254B2High density opto-electronic interconnection configuration utilizing passive alignmentAAYUNA INC·Filed 2018·Granted Jul 28, 2020·12 cites·17 claims
- 0788US7269809B2Integrated approach for design, simulation and verification of monolithic, silicon-based opto-electronic circuitsSIOPTICAL INC·Filed 2005·Granted Sep 11, 2007·20 cites·18 claims
- 0886US9031107B2Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic componentsCISCO TECH INC·Filed 2014·Granted May 12, 2015·5 cites·20 claims
- 0986US8724939B2Enhanced low inductance interconnections between electronic and opto-electronic integrated circuitsSHASTRI KALPENDU·Filed 2012·Granted May 13, 2014·4 cites·6 claims
- 1085US7570889B2Common electronic dispersion compensation arrangement for use with multiple optical communication channelsLIGHTWIRE INC·Filed 2006·Granted Aug 4, 2009·13 cites·8 claims
- 1184US9235019B2Self-aligning optical connector assemblyCISCO TECH INC·Filed 2014·Granted Jan 12, 2016·6 cites·9 claims
- 1281US8929689B2Optical modulator utilizing unary encoding and auxiliary modulator section for load balancingMETZ PETER C·Filed 2012·Granted Jan 6, 2015·8 cites·17 claims
- 1381US8364042B2Optical interconnection arrangement for high speed, high density communication systemsSHASTRI KALPENDU·Filed 2010·Granted Jan 29, 2013·6 cites·10 claims
- 1473US9209509B2Enhanced low inductance interconnections between electronic and opto-electronic integrated circuitsCISCO TECH INC·Filed 2014·Granted Dec 8, 2015·1 cites·16 claims
- 1573US8876410B2Self-aligning connectorized fiber array assemblyCISCO TECH INC·Filed 2013·Granted Nov 4, 2014·3 cites·20 claims
- 1670US12449603B2Passively-aligned fiber array to waveguide configurationAAYUNA INC·Filed 2023·Granted Oct 21, 2025·0 cites·11 claims
- 1769US9435965B2Single mode fiber array connector for opto-electronic transceiversCISCO TECH INC·Filed 2013·Granted Sep 6, 2016·2 cites·18 claims
- 1869US9343450B2Wafer scale packaging platform for transceiversCISCO TECH INC·Filed 2014·Granted May 17, 2016·2 cites·20 claims
- 1964US2023260417A1On-Line Instructional System And 3D Tools For Student-Centered LearningSARAS 3D INC·Filed 2023·Application pending·0 cites
- 2062US9793902B2Reference-less clock and data recovery circuitCISCO TECH INC·Filed 2016·Granted Oct 17, 2017·2 cites·15 claims
- 2160US2021375150A1On-Line Instructional System And 3D Tools For Student-Centered LearningSARAS 3D INC·Filed 2019·Application pending·0 cites
- 2257US11886013B2Passively-aligned fiber array to waveguide configurationAAYUNA INC·Filed 2020·Granted Jan 30, 2024·0 cites·7 claims
- 2351US9052445B2Molded glass lid for wafer level packaging of opto-electronic assembliesCISCO TECH INC·Filed 2012·Granted Jun 9, 2015·0 cites·13 claims
- 2448US9575266B2Molded glass lid for wafer level packaging of opto-electronic assembliesCISCO TECH INC·Filed 2015·Granted Feb 21, 2017·0 cites·12 claims
- 2547US2023305244A1High density optical/electrical interconnection arrangement with high thermal efficiencyAAYUNA INC·Filed 2021·Application pending·0 cites
- 2646US2025202886A1Authentication and Security Protocols for On-Line Instructional SystemSARAS 3D INC·Filed 2023·Application pending·0 cites
- 2744US2013188970A1Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning MirrorsSHASTRI KALPENDU·Filed 2013·Application pending·0 cites
- 2842US2021398961A1High Density Optical Interconnection AssemblyAAYUNA INC·Filed 2019·Application pending·0 cites
- 2941US2022329041A1Laser Engine Supporting Multiple Laser SourcesAAYUNA INC·Filed 2020·Application pending·0 cites
- 3040US11611738B2User interface module for converting a standard 2D display device into an interactive 3D display deviceSARAS 3D INC·Filed 2019·Granted Mar 21, 2023·0 cites·5 claims
- 3140US2022183544A1Medical Instrumentation Utilizing Narrowband ImagingNSV INC·Filed 2020·Application pending·0 cites
- 3239US2006126993A1SOI-based optical interconnect arrangementSIOPTICAL INC·Filed 2005·Application pending·0 cites
- 3336US2020409478A1Enhanced 2D/3D Mouse For Computer Display InteractionsSARAS 3D INC·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →