Inventor · disambiguated record
Venkateshwaran Vaiyapuri
Also filed as: VAIYAPURI VENKATESHWARAN
14 granted patents·3 pending applications·460 citations·filing 1999–2007
94Inventor score
Technology areasH10W
Top patents by PatentIndex Score
17 records- 0194US6274930B1Multi-chip module with stacked diceMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 14, 2001·84 cites·20 claims
- 0293US6507107B2Semiconductor/printed circuit board assemblyMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 14, 2003·69 cites·16 claims
- 0391US6207467B1Multi-chip module with stacked diceMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 27, 2001·107 cites·20 claims
- 0487US6629425B2MEMS heat pumps for integrated circuit heat dissipationMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 7, 2003·32 cites·10 claims
- 0586US6469376B2Die support structureMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 22, 2002·41 cites·26 claims
- 0684US7084004B2MEMS heat pumps for integrated circuit heat dissipationMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 1, 2006·23 cites·12 claims
- 0783US7514776B2Semiconductor/printed circuit board assembly, and computer systemMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 7, 2009·9 cites·8 claims
- 0880US7107777B2MEMS heat pumps for integrated circuit heat dissipationMICRO TECHNOLOGY INC·Filed 2003·Granted Sep 19, 2006·17 cites·8 claims
- 0978US6869827B2Semiconductor/printed circuit board assembly, and computer systemMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 22, 2005·20 cites·13 claims
- 1076US6762079B2Methods for fabricating dual loc semiconductor die assembly employing floating lead finger structureMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 13, 2004·21 cites·28 claims
- 1170US6541846B2Dual LOC semiconductor assembly employing floating lead finger structureMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 1, 2003·16 cites·14 claims
- 1265US7427535B2Semiconductor/printed circuit board assembly, and computer systemMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 23, 2008·9 cites·13 claims
- 1364US6798055B2Die support structureMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 28, 2004·12 cites·25 claims
- 1451US2006236710A1MEMS heat pumps for integrated circuit heat dissipationVAIYAPURI VENKATESHWARAN·Filed 2006·Application pending·0 cites
- 1551US2006236711A1MEMS heat pumps for integrated circuit heat dissipationVAIYAPURI VENKATESHWARAN·Filed 2006·Application pending·0 cites
- 1650US2006189022A1MEMS heat pumps for integrated circuit heat dissipationVAIYAPURI VENKATESHWARAN·Filed 2006·Application pending·0 cites
- 1739US6844217B2Die support structureMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 18, 2005·0 cites·25 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →