Inventor · disambiguated record
Masahiro Nakayama
Also filed as: NAKAYAMA MASAHIRO
30 granted patents·11 pending applications·478 citations·filing 1986–2020
97Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES16HITACHI LTD4NAKAYAMA MASAHIRO3RICOH KK3VICTOR COMPANY OF JAPAN2
Top patents by PatentIndex Score
41 records- 0198US7313349B2Toner container and image forming apparatusRICOH KK·Filed 2006·Granted Dec 25, 2007·67 cites·18 claims
- 0294US7505718B2Container, toner container, image forming apparatus, and image forming processRICOH KK·Filed 2006·Granted Mar 17, 2009·17 cites·22 claims
- 0391US7786488B2Nitride semiconductor wafer and method of processing nitride semiconductor waferSUMITOMO ELECTRIC INDUSTRIES·Filed 2009·Granted Aug 31, 2010·12 cites·10 claims
- 0490US7535082B2Nitride semiconductor wafer and method of processing nitride semiconductor waferSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Granted May 19, 2009·11 cites·4 claims
- 0589US6875082B2Nitride semiconductor wafer and method of processing nitride semiconductor waferSUMITOMO ELECTRIC INDUSTRIES·Filed 2003·Granted Apr 5, 2005·32 cites·11 claims
- 0689US5404406AMethod for controlling localization of sound imageVICTOR COMPANY OF JAPAN·Filed 1993·Granted Apr 4, 1995·90 cites·7 claims
- 0788US8008165B2Nitride semiconductor wafer and method of processing nitride semiconductor waferSUMITOMO ELECTRIC INDUSTRIES·Filed 2010·Granted Aug 30, 2011·6 cites·2 claims
- 0888US7550780B2Chamfered freestanding nitride semiconductor wafer and method of chamfering nitride semiconductor waferSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Jun 23, 2009·9 cites·2 claims
- 0987US7749325B2Method of producing gallium nitride (GaN) independent substrate, method of producing GaN crystal body, and method of producing GaN substrateSUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Granted Jul 6, 2010·12 cites·5 claims
- 1087US5598478ASound image localization control apparatusVICTOR COMPANY OF JAPAN·Filed 1993·Granted Jan 28, 1997·79 cites·11 claims
- 1174US7195545B2Chamfered freestanding nitride semiconductor wafer and method of chamfering nitride semiconductor waferSUMITOMO ELECTRIC INDUSTRIES·Filed 2003·Granted Mar 27, 2007·11 cites·2 claims
- 1273US8022438B2Chamfered freestanding nitride semiconductor wafer and method of chamfering nitride semiconductor waferSUMITOMO ELECTRIC INDUSTRIES·Filed 2009·Granted Sep 20, 2011·2 cites·4 claims
- 1372US8482032B2Chamfered freestanding nitride semiconductor wafer and method of chamfering nitride semiconductor waferNAKAYAMA MASAHIRO·Filed 2011·Granted Jul 9, 2013·2 cites·4 claims
- 1472US7154131B2Nitride semiconductor substrate and method of producing sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2004·Granted Dec 26, 2006·12 cites·3 claims
- 1572US6909165B2Obverse/reverse discriminative rectangular nitride semiconductor waferSUMITOMO ELECTRIC INDUSTRIES·Filed 2003·Granted Jun 21, 2005·18 cites·16 claims
- 1668US8156999B2Indoor unit of air conditionerISHIBASHI AKIRA·Filed 2005·Granted Apr 17, 2012·4 cites·10 claims
- 1765US7149462B2Container, toner container, image forming apparatus, and image forming processRICOH KK·Filed 2004·Granted Dec 12, 2006·16 cites·22 claims
- 1855US4814904AMethod of controlling erasing following format writing in a magnetic disc apparatusHITACHI LTD·Filed 1986·Granted Mar 21, 1989·11 cites·4 claims
- 1954US8133815B2Method of polishing compound semiconductor substrate, compound semiconductor substrate, method of manufacturing compound semiconductor epitaxial substrate, and compound semiconductor epitaxial substrateMEZAKI YOSHIO·Filed 2007·Granted Mar 13, 2012·1 cites·4 claims
- 2054US5315447ADisk control method of format write operation using data distance on a trackHITACHI LTD·Filed 1992·Granted May 24, 1994·31 cites·2 claims
- 2153US11294746B2Extracting moving image data from an error log included in an operational log of a terminalFUJITSU LTD·Filed 2020·Granted Apr 5, 2022·0 cites·11 claims
- 2253US5987914ARefrigerating/air-conditioning apparatusMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Nov 23, 1999·10 cites·15 claims
- 2352US7387678B2GaN substrate and method of fabricating the same, nitride semiconductor device and method of fabricating the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2004·Granted Jun 17, 2008·3 cites·34 claims
- 2451US8723219B2Chamfered freestanding nitride semiconductor wafer and method of chamfering nitride semiconductor waferITAMI WORKS OF SUMITOMO ELECTRIC IND LTD·Filed 2013·Granted May 13, 2014·0 cites·4 claims
- 2551US2010095689A1Vehicle air conditioner and method for controlling the sameMITSUBISHI HEAVY IND LTD·Filed 2008·Application pending·0 cites
- 2650US7390747B2Nitride semiconductor substrate and method of producing sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Granted Jun 24, 2008·0 cites·2 claims
- 2749US6340275B1Chamfering methodTOYOTA MOTOR CO LTD·Filed 1999·Granted Jan 22, 2002·16 cites·14 claims
- 2849US2009188114A1Cutting device and cutting methodADACHI MASAMI·Filed 2005·Application pending·0 cites
- 2948US7518301B2Electron tubesFUTABA DENSHI KOGYO KK·Filed 2005·Granted Apr 14, 2009·0 cites·13 claims
- 3046US4805048AMethod for controlling to keep off defects on magnetic disksHITACHI LTD·Filed 1987·Granted Feb 14, 1989·6 cites·1 claims
- 3146US2008194182A1Mechano-chemical polishing method for GaAs waferSUMITOMO ELECTRIC INDUSTRIES·Filed 2008·Application pending·0 cites
- 3246US2010013053A1Method for manufacturing iii-v compound semiconductor substrate, method for manufacturing epitaxial wafer, iii-v compound semiconductor substrate, and epitaxial waferSUMITOMO ELECTRIC INDUSTRIES·Filed 2009·Application pending·0 cites
- 3345US2005006135A1Airtight cable and a manufacturing method of airtight cableKURABE IND CO LTD·Filed 2004·Application pending·0 cites
- 3444US2015170928A1Silicon carbide substrate and fabrication method thereofSUMITOMO ELECTRIC INDUSTRIES·Filed 2013·Application pending·0 cites
- 3544US2007018284A1Gallium nitride semiconductor substrate and process for producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2004·Application pending·0 cites
- 3644US2012135549A1Method of Processing Gallium-Nitride Semiconductor SubstratesNAKAYAMA MASAHIRO·Filed 2012·Application pending·0 cites
- 3740US11999308B2Impact energy absorbing memberTOYOTA JIDOSHOKKI KK·Filed 2020·Granted Jun 4, 2024·0 cites·2 claims
- 3838US2015135517A1Degradation diagnosis device for cell, degradation diagnosis method, and method for manufacturing cellDOI TAKAYOSHI·Filed 2012·Application pending·0 cites
- 3938US2015379379A1Printing Apparatus And Print Control DeviceSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
- 4037US2009057847A1Gallium nitride waferNAKAYAMA MASAHIRO·Filed 2006·Application pending·0 cites
- 4130US5315451ARotating storage track format emulationHITACHI LTD·Filed 1991·Granted May 24, 1994·0 cites·14 claims
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