Inventor · disambiguated record
Chia-Hao Cheng
Also filed as: CHENG CHIA-HAO
7 granted patents·2 pending applications·5 citations·filing 2019–2023
73Inventor score
Files withADVANCED MICRO DEVICES INC9
Top patents by PatentIndex Score
9 records- 0186US11011466B2Integrated circuit package with integrated voltage regulatorADVANCED MICRO DEVICES INC·Filed 2019·Granted May 18, 2021·4 cites·9 claims
- 0270US11742301B2Fan-out package with reinforcing rivetsADVANCED MICRO DEVICES INC·Filed 2019·Granted Aug 29, 2023·1 cites·20 claims
- 0365US11715691B2Integrated circuit package with integrated voltage regulatorADVANCED MICRO DEVICES INC·Filed 2021·Granted Aug 1, 2023·0 cites·15 claims
- 0455US12424560B2Semiconductor chip deviceADVANCED MICRO DEVICES INC·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
- 0553US11309222B2Semiconductor chip with solder cap probe test padsADVANCED MICRO DEVICES INC·Filed 2019·Granted Apr 19, 2022·0 cites·20 claims
- 0650US12394683B2Molded semiconductor chip package with stair-step molding layerADVANCED MICRO DEVICES INC·Filed 2020·Granted Aug 19, 2025·0 cites·22 claims
- 0750US2023120305A1Testing a semiconductor die using temporary test pads applied to conductive pads of the semiconductor dieADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 0848US12183675B2Fan-out packages with warpage resistanceADVANCED MICRO DEVICES INC·Filed 2019·Granted Dec 31, 2024·0 cites·18 claims
- 0948US2025293210A1Systems and methods for packaging a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →