Inventor · disambiguated record
Anthony M. Chiu
Also filed as: CHIU ANTHONY · CHIU ANTHONY M · CHIU ANTHONY MAN-CHONG
83 granted patents·9 pending applications·1,539 citations·filing 1984–2025
99Inventor score
Files withST MICROELECTRONICS INC46TEXAS INSTRUMENTS INC21QORVO US INC14CHIU ANTHONY M4SGS THOMSON MICROELECTRONICS1
Top patents by PatentIndex Score
92 records- 0195US5358905ASemiconductor device having die pad locking to substantially reduce package crackingTEXAS INSTRUMENTS INC·Filed 1993·Granted Oct 25, 1994·187 cites·20 claims
- 0291US9899292B2Top-side cooling of RF products in air cavity composite packagesQORVO US INC·Filed 2016·Granted Feb 20, 2018·12 cites·20 claims
- 0391US6414849B1Low stress and low profile cavity down flip chip and wire bond BGA packageST MICROELECTRONICS INC·Filed 1999·Granted Jul 2, 2002·81 cites·22 claims
- 0489US5532614AWafer burn-in and test systemTEXAS INSTRUMENTS INC·Filed 1995·Granted Jul 2, 1996·82 cites·5 claims
- 0587US7382056B2Integrated passive devicesSYCHIP INC·Filed 2005·Granted Jun 3, 2008·20 cites·20 claims
- 0687US5805419ALow-profile socketed packaging system with land-grid array and thermally conductive slugST MICROELECTRONICS INC·Filed 1996·Granted Sep 8, 1998·70 cites·31 claims
- 0786US7109574B2Integrated circuit package with exposed die surfaces and auxiliary attachmentST MICROELECTRONICS INC·Filed 2003·Granted Sep 19, 2006·43 cites·30 claims
- 0885US6100194ASilver metallization by damascene methodST MICROELECTRONICS INC·Filed 1998·Granted Aug 8, 2000·64 cites·27 claims
- 0984US11637050B2Package architecture utilizing wafer to wafer bondingQORVO US INC·Filed 2021·Granted Apr 25, 2023·1 cites·20 claims
- 1084US5307010AWafer burn-in and test systemTEXAS INSTRUMENTS INC·Filed 1992·Granted Apr 26, 1994·67 cites·4 claims
- 1184US4639664AApparatus for testing a plurality of integrated circuits in parallelTEXAS INSTRUMENTS INC·Filed 1984·Granted Jan 27, 1987·56 cites·12 claims
- 1283US6771500B1System and method for direct convective cooling of an exposed integrated circuit die surfaceST MICROELECTRONICS INC·Filed 2003·Granted Aug 3, 2004·34 cites·34 claims
- 1379US5942798AApparatus and method for automating the underfill of flip-chip devicesST MICROELECTRONICS INC·Filed 1997·Granted Aug 24, 1999·47 cites·13 claims
- 1479US2024379487A1Package architecture utilizing wafer to wafer bondingQORVO US INC·Filed 2024·Application pending·0 cites
- 1577US12087656B2Package architecture utilizing wafer to wafer bondingQORVO US INC·Filed 2023·Granted Sep 10, 2024·0 cites·23 claims
- 1677US6011301AStress reduction for flip chip packageST MICROELECTRONICS INC·Filed 1998·Granted Jan 4, 2000·43 cites·14 claims
- 1776US12308326B2Electronic component with lid to manage radiation feedbackQORVO US INC·Filed 2024·Granted May 20, 2025·0 cites·20 claims
- 1876US9113549B2Enclosure for a multi-channel modulator driverSTEINBEISER CRAIG·Filed 2011·Granted Aug 18, 2015·5 cites·14 claims
- 1976US7595017B2Method for using a pre-formed film in a transfer molding process for an integrated circuitST MICROELECTRONICS INC·Filed 2002·Granted Sep 29, 2009·21 cites·21 claims
- 2076US6214643B1Stress reduction for flip chip packageST MICROELECTRONICS INC·Filed 1999·Granted Apr 10, 2001·39 cites·19 claims
- 2175US6228679B1Apparatus and method for automating the underfill of flip-chip devicesST MICROELECTRONICS INC·Filed 1999·Granted May 8, 2001·38 cites·19 claims
- 2274US7098065B2Integrated lid formed on MEMS deviceST MICROELECTRONICS INC·Filed 2004·Granted Aug 29, 2006·18 cites·24 claims
- 2374US6769174B2Leadframeless package structure and methodSTMICROELETRONICS INC·Filed 2002·Granted Aug 3, 2004·16 cites·20 claims
- 2474US5444366AWafer burn-in and test systemTEXAS INSTRUMENTS INC·Filed 1994·Granted Aug 22, 1995·41 cites·3 claims
- 2572US8202668B2Fuel cell deviceCHIU ANTHONY M·Filed 2009·Granted Jun 19, 2012·1 cites·4 claims
- 2671US7323114B2Method of making optical elements for an optical disc systemST MICROELECTRONICS INC·Filed 2005·Granted Jan 29, 2008·4 cites·7 claims
- 2770US7786582B2System for providing a redistribution metal layer in an integrated circuitST MICROELECTRONICS INC·Filed 2006·Granted Aug 31, 2010·4 cites·12 claims
- 2870US7534716B2System and method for venting pressure from an integrated circuit package sealed with a lidST MICROELECTRONICS INC·Filed 2006·Granted May 19, 2009·4 cites·20 claims
- 2970US7126210B2System and method for venting pressure from an integrated circuit package sealed with a lidST MICROELECTRONICS INC·Filed 2003·Granted Oct 24, 2006·15 cites·20 claims
- 3070US6437984B1Thermally enhanced chip scale packageST MICROELECTRONICS INC·Filed 2000·Granted Aug 20, 2002·17 cites·20 claims
- 3169US6787388B1Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD deviceST MICROELECTRONICS INC·Filed 2000·Granted Sep 7, 2004·13 cites·20 claims
- 3269US6700190B2Integrated circuit device with exposed upper and lower die surfacesST MICROELECTRONICS INC·Filed 2002·Granted Mar 2, 2004·15 cites·27 claims
- 3368US5358598AFolded bus bar leadframe and method of makingTEXAS INSTRUMENTS INC·Filed 1994·Granted Oct 25, 1994·31 cites·4 claims
- 3468US2025201728A1Electronic component with lid to manage radiation feedbackQORVO US INC·Filed 2025·Application pending·0 cites
- 3567US11948893B2Electronic component with lid to manage radiation feedbackQORVO US INC·Filed 2021·Granted Apr 2, 2024·0 cites·19 claims
- 3667US7061091B2Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD deviceST MICROELECTRONICS INC·Filed 2004·Granted Jun 13, 2006·11 cites·12 claims
- 3767US5359493AThree dimensional multi-chip module with integral heat sinkTEXAS INSTRUMENTS INC·Filed 1993·Granted Oct 25, 1994·35 cites·11 claims
- 3866US8367271B2Fuel cell deviceST MICROELECTRONICS INC·Filed 2009·Granted Feb 5, 2013·0 cites·13 claims
- 3966US2025385423A1Antenna packageQORVO US INC·Filed 2025·Application pending·0 cites
- 4064US10177064B2Air cavity packageQORVO US INC·Filed 2016·Granted Jan 8, 2019·1 cites·23 claims
- 4164US8202667B2Fuel cell deviceCHIU ANTHONY M·Filed 2009·Granted Jun 19, 2012·0 cites·5 claims
- 4264US8178250B2Fuel cell deviceCHIU ANTHONY M·Filed 2009·Granted May 15, 2012·0 cites·14 claims
- 4364US6372543B1Wrap-around interconnect for fine pitch ball grid arrayST MICROELECTRONICS INC·Filed 2000·Granted Apr 16, 2002·10 cites·20 claims
- 4464US5136367ALow cost erasable programmable read only memory packageTEXAS INSTRUMENTS INC·Filed 1990·Granted Aug 4, 1992·23 cites·24 claims
- 4563US6410985B1Silver metallization by damascene methodST MICROELECTRONICS INC·Filed 2000·Granted Jun 25, 2002·7 cites·26 claims
- 4661US7096581B2Method for providing a redistribution metal layer in an integrated circuitST MICROELECTRONICS INC·Filed 2002·Granted Aug 29, 2006·7 cites·11 claims
- 4761US5286999AFolded bus bar leadframeTEXAS INSTRUMENTS INC·Filed 1992·Granted Feb 15, 1994·24 cites·10 claims
- 4861US5192681ALow cost erasable programmable read only memory packageTEXAS INSTRUMENTS INC·Filed 1992·Granted Mar 9, 1993·20 cites·2 claims
- 4960US8163645B2Method for providing a redistribution metal layer in an integrated circuitTHOMAS DANIELLE A·Filed 2010·Granted Apr 24, 2012·1 cites·20 claims
- 5060US7265452B2System and method for increasing the strength of a bond made by a small diameter wire in ball bondingST MICROELECTRONICS INC·Filed 2005·Granted Sep 4, 2007·1 cites·20 claims
Showing the top 50 of 92 patent records by PatentIndex Score.
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