Inventor · disambiguated record
Dean J. Denning
Also filed as: DENNING DEAN · DENNING DEAN J
15 granted patents·5 pending applications·1,008 citations·filing 1993–2014
95Inventor score
Top patents by PatentIndex Score
20 records- 0196US5308788ATemperature controlled process for the epitaxial growth of a film of materialMOTOROLA INC·Filed 1993·Granted May 3, 1994·330 cites·30 claims
- 0295US6218302B1Method for forming a semiconductor deviceMOTOROLA INC·Filed 1998·Granted Apr 17, 2001·222 cites·22 claims
- 0391US5893752AProcess for forming a semiconductor deviceMOTOROLA INC·Filed 1997·Granted Apr 13, 1999·142 cites·22 claims
- 0488US6187682B1Inert plasma gas surface cleaning process performed insitu with physical vapor deposition (PVD) of a layer of materialMOTOROLA INC·Filed 1998·Granted Feb 13, 2001·94 cites·21 claims
- 0583US6136682AMethod for forming a conductive structure having a composite or amorphous barrier layerMOTOROLA INC·Filed 1997·Granted Oct 24, 2000·73 cites·19 claims
- 0682US6294458B1Semiconductor device adhesive layer structure and process for forming structureMOTOROLA INC·Filed 2000·Granted Sep 25, 2001·36 cites·24 claims
- 0775US6500315B1Method and apparatus for forming a layer on a substrateMOTOROLA INC·Filed 2000·Granted Dec 31, 2002·15 cites·23 claims
- 0872US6451181B1Method of forming a semiconductor device barrier layerMOTOROLA INC·Filed 1999·Granted Sep 17, 2002·36 cites·6 claims
- 0963US5958508AProcess for forming a semiconductor deviceMOTOROLA INC·Filed 1997·Granted Sep 28, 1999·29 cites·20 claims
- 1057US9209078B2Method of making a die with recessed aluminum die padsSPENCER GREGORY S·Filed 2014·Granted Dec 8, 2015·1 cites·20 claims
- 1157US6139696AMethod and apparatus for forming a layer on a substrateMOTOROLA INC·Filed 1999·Granted Oct 31, 2000·18 cites·2 claims
- 1249US6632689B2Method for processing semiconductor wafers in an enclosure with a treated interior surfaceMOTOROLA INC·Filed 2002·Granted Oct 14, 2003·2 cites·28 claims
- 1347US5721167AProcess for forming a semiconductor device and a static-random-access memory cellMOTOROLA INC·Filed 1997·Granted Feb 24, 1998·9 cites·13 claims
- 1445US8722530B2Method of making a die with recessed aluminum die padsSPENCER GREGORY S·Filed 2011·Granted May 13, 2014·0 cites·19 claims
- 1545US6476623B1Percent backsputtering as a control parameter for metallizationMOTOROLA INC·Filed 2000·Granted Nov 5, 2002·1 cites·12 claims
- 1645US2011027950A1Method for forming a semiconductor device having a photodetectorJONES ROBERT E·Filed 2009·Application pending·0 cites
- 1739US2002092763A1Method for forming a barrier layer for use in a copper interconnectFiled 2002·Application pending·0 cites
- 1836US2004211661A1Method for plasma deposition of a substrate barrier layerFiled 2003·Application pending·0 cites
- 1934US2003203615A1Method for depositing barrier layers in an openingFiled 2002·Application pending·0 cites
- 2029US2003134504A1Method of making an inlaid structure in a semiconductor deviceFiled 2002·Application pending·0 cites
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