Inventor · disambiguated record
Morihiko Ikemizu
Also filed as: IKEMIZU MORIHIKO
11 granted patents·510 citations·filing 1993–2018
92Inventor score
Files withTOSHIBA KK11
Top patents by PatentIndex Score
11 records- 0194US6326243B1Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resinTOSHIBA KK·Filed 1997·Granted Dec 4, 2001·200 cites·12 claims
- 0283US5612259AMethod for manufacturing a semiconductor device wherein a semiconductor chip is mounted on a lead frameTOSHIBA KK·Filed 1995·Granted Mar 18, 1997·82 cites·21 claims
- 0382US5892277ATab tape and semiconductor device using the tab tapeTOSHIBA KK·Filed 1997·Granted Apr 6, 1999·62 cites·11 claims
- 0475US5359222ATCP type semiconductor device capable of preventing crosstalkTOSHIBA KK·Filed 1993·Granted Oct 25, 1994·49 cites·9 claims
- 0573US5659198ATCP type semiconductor device capable of preventing crosstalkTOSHIBA KK·Filed 1995·Granted Aug 19, 1997·42 cites·24 claims
- 0662US6097085AElectronic device and semiconductor packageTOSHIBA KK·Filed 1998·Granted Aug 1, 2000·33 cites·11 claims
- 0761US5753969AResin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resinTOSHIBA KK·Filed 1996·Granted May 19, 1998·25 cites·9 claims
- 0843US6495922B2Semiconductor device with pointed bumpsTOSHIBA KK·Filed 2001·Granted Dec 17, 2002·2 cites·10 claims
- 0942US5442232AThin semiconductor package having many pins and likely to dissipate heatTOSHIBA KK·Filed 1993·Granted Aug 15, 1995·10 cites·11 claims
- 1040US10840166B2Semiconductor deviceTOSHIBA KK·Filed 2018·Granted Nov 17, 2020·0 cites·8 claims
- 1136US5652184AMethod of manufacturing a thin semiconductor package having many pins and likely to dissipate heatTOSHIBA KK·Filed 1995·Granted Jul 29, 1997·5 cites·2 claims
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