Inventor · disambiguated record
Atul Madhavan
Also filed as: MADHAVAN ATUL
8 granted patents·8 pending applications·21 citations·filing 2017–2024
84Inventor score
Files withINTEL CORP16
Top patents by PatentIndex Score
16 records- 0197US11031487B2Contact over active gate structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2019·Granted Jun 8, 2021·7 cites·20 claims
- 0296US10541316B2Contact over active gate structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Jan 21, 2020·9 cites·25 claims
- 0392US11581420B2Contact over active gate structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2021·Granted Feb 14, 2023·2 cites·20 claims
- 0486US11393754B2Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabricationINTEL CORP·Filed 2018·Granted Jul 19, 2022·3 cites·8 claims
- 0582US12261122B2Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabricationINTEL CORP·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0681US2024347465A1Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabricationINTEL CORP·Filed 2024·Application pending·0 cites
- 0777US12406931B2Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabricationINTEL CORP·Filed 2022·Granted Sep 2, 2025·0 cites·21 claims
- 0876US2025022939A1Contact over active gate structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2024·Application pending·0 cites
- 0974US12142667B2Contact over active gate structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2023·Granted Nov 12, 2024·0 cites·21 claims
- 1057US2025210509A1Single damascene via profiles for advanced integrated circuit structure fabricationINTEL CORP·Filed 2023·Application pending·0 cites
- 1156US2025112037A1Selective dielectric growth for directing contact to gate or contact to trench contactINTEL CORP·Filed 2023·Application pending·0 cites
- 1254US2020043850A1Pitch-divided interconnects for advanced integrated circuit structure fabricationINTEL CORP·Filed 2019·Application pending·0 cites
- 1353US12394722B2Dielectric capacitance recovery of inter-layer dielectric layers for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Granted Aug 19, 2025·0 cites·20 claims
- 1453US2025311402A1Integrated circuit structures having contacts to links for uniform grid metal gate and trench contact cutINTEL CORP·Filed 2024·Application pending·0 cites
- 1549US2019164890A1Pitch-divided interconnects for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Application pending·0 cites
- 1642US2022068802A1Metal line and via barrier layers, and via profiles, for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →