Inventor · disambiguated record
Shi-Bai Chen
Also filed as: CHEN SHI · CHEN SHI-BAI
13 granted patents·8 pending applications·106 citations·filing 2004–2023
91Inventor score
Top patents by PatentIndex Score
21 records- 0190US7667302B1Integrated circuit chip with seal ring structureMEDIATEK INC·Filed 2008·Granted Feb 23, 2010·23 cites·14 claims
- 0289US8174091B2Fuse structureTHEI KONG-BENG·Filed 2009·Granted May 8, 2012·13 cites·20 claims
- 0383US8242586B2Integrated circuit chip with seal ring structureCHANG TIEN-CHANG·Filed 2009·Granted Aug 14, 2012·12 cites·16 claims
- 0481US8629050B2E-fuse structure design in electrical programmable redundancy for embedded memory circuitTHEI KONG-BENG·Filed 2012·Granted Jan 14, 2014·4 cites·20 claims
- 0576US6956277B1Diode junction poly fuseTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 18, 2005·19 cites·10 claims
- 0674US9099467B2E-fuse structure design in electrical programmable redundancy for embedded memory circuitTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 4, 2015·2 cites·20 claims
- 0772US8361757B2Semiconductor device assembly and method thereofMEDIATEK INC·Filed 2011·Granted Jan 29, 2013·3 cites·15 claims
- 0870US8049321B2Semiconductor device assembly and method thereofMEDIATEK INC·Filed 2009·Granted Nov 1, 2011·4 cites·15 claims
- 0968US10910320B2Shielded MOM capacitorMEDIATEK INC·Filed 2018·Granted Feb 2, 2021·1 cites·18 claims
- 1066US7109564B2Low power fuse structure and method of making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Sep 19, 2006·13 cites·18 claims
- 1159US2024234295A9Semiconductor package structureMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1258US7304366B2Self correcting multiple-link fuseTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Dec 4, 2007·12 cites·20 claims
- 1358US2024038647A1Semiconductor package using substrate block integrationMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1458US2024038648A1Semiconductor package using substrate block integrationMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1549US12481138B2Lens module, camera module, and terminalHUAWEI TECH CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 1648US7892895B2Diode junction poly fuseTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 22, 2011·0 cites·10 claims
- 1748US2005285222A1New fuse structureTHEI KONG-BENG·Filed 2005·Application pending·0 cites
- 1845US2011108974A1Power and signal distribution of integrated circuitsMEDIATEK INC·Filed 2009·Application pending·0 cites
- 1944US2009243032A1Electrical fuse structureCHEN SHI-BAI·Filed 2008·Application pending·0 cites
- 2042US2016027772A1Integrated capacitor in an integrated circuitMEDIATEK INC·Filed 2014·Application pending·0 cites
- 2137US2012154102A1Electrical fuse structureCHEN SHI-BAI·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →