Inventor · disambiguated record
Iwona Turlik
Also filed as: TURLIK IWONA
20 granted patents·6 pending applications·2,278 citations·filing 1984–2007
97Inventor score
Top patents by PatentIndex Score
26 records- 0197US6194250B1Low-profile microelectronic packageMOTOROLA INC·Filed 1998·Granted Feb 27, 2001·385 cites·12 claims
- 0295US5638469AMicroelectronic module having optical and electrical interconnectsMCNC·Filed 1993·Granted Jun 10, 1997·161 cites·50 claims
- 0395US5325265AHigh performance integrated circuit chip packageMCNC·Filed 1992·Granted Jun 28, 1994·252 cites·29 claims
- 0495US5289631AMethod for testing, burn-in, and/or programming of integrated circuit chipsMCNC·Filed 1992·Granted Mar 1, 1994·222 cites·9 claims
- 0594US6730056B1Eye implant for treating glaucoma and method for manufacturing sameMOTOROLA INC·Filed 2000·Granted May 4, 2004·314 cites·28 claims
- 0694US5844315ALow-profile microelectronic packageMOTOROLA CORP·Filed 1996·Granted Dec 1, 1998·216 cites·25 claims
- 0792US7206044B2Display and solar cell deviceMOTOROLA INC·Filed 2001·Granted Apr 17, 2007·45 cites·10 claims
- 0892US6049463AMicroelectronic assembly including an antenna element embedded within a polymeric card, and method for forming sameMOTOROLA INC·Filed 1997·Granted Apr 11, 2000·204 cites·10 claims
- 0987US5237434AMicroelectronic module having optical and electrical interconnectsMCNC·Filed 1991·Granted Aug 17, 1993·75 cites·27 claims
- 1085US5447264ARecessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereonMCNC·Filed 1994·Granted Sep 5, 1995·79 cites·26 claims
- 1182US5381946AMethod of forming differing volume solder bumpsMCNC·Filed 1993·Granted Jan 17, 1995·60 cites·8 claims
- 1275US6829502B2Brain response monitoring apparatus and methodMOTOROLA INC·Filed 2002·Granted Dec 7, 2004·27 cites·38 claims
- 1375US5923796AMicroelectronic module having optical and electrical interconnectsMCNC·Filed 1997·Granted Jul 13, 1999·35 cites·19 claims
- 1473US5168078AMethod of making high density semiconductor structureMCNC·Filed 1990·Granted Dec 1, 1992·48 cites·43 claims
- 1563US5374893AApparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereonMCNC·Filed 1993·Granted Dec 20, 1994·28 cites·11 claims
- 1658US6285899B1Remotely interrogated biomedical sensorMOTOROLA INC·Filed 1999·Granted Sep 4, 2001·87 cites·2 claims
- 1755US2008255996A1System and Method for Exchanging Assets in a NetworkMOTOROLA INC·Filed 2007·Application pending·0 cites
- 1848US5145714AMetal-organic chemical vapor deposition for repairing broken lines in microelectronic packagesMCNC·Filed 1990·Granted Sep 8, 1992·18 cites·19 claims
- 1948US2007281676A1Multi model address bookMOTOROLA INC·Filed 2006·Application pending·0 cites
- 2047US5025304AHigh density semiconductor structure and method of making the sameMCNC·Filed 1988·Granted Jun 18, 1991·13 cites·3 claims
- 2147US2008135282A1Printed multilayer circuit containing active devices and method of manufaturingMOTOROLA INC·Filed 2006·Application pending·0 cites
- 2247US2005150540A1Display and solar cell deviceFiled 2005·Application pending·0 cites
- 2346US2008146416A1Generation of user activity feedbackMOTOROLA INC·Filed 2006·Application pending·0 cites
- 2441US2006089557A1Method and apparatus to facilitate heart rate detectionMOTOROLA INC·Filed 2004·Application pending·0 cites
- 2537US4483541AGas seal for semiconductor processing equipmentNORTHERN TELECOM LTD·Filed 1984·Granted Nov 20, 1984·5 cites·8 claims
- 2634US5009360AMetal-to-metal bonding method and resulting structureMCNC·Filed 1990·Granted Apr 23, 1991·4 cites·11 claims
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