Inventor · disambiguated record
Kazumi Hara
Also filed as: HARA KAZUMI
10 granted patents·2 pending applications·104 citations·filing 2004–2020
89Inventor score
Top patents by PatentIndex Score
12 records- 0187US7255428B2Droplet ejection head and droplet ejection apparatusSEIKO EPSON CORP·Filed 2005·Granted Aug 14, 2007·10 cites·6 claims
- 0286US7358602B2Semiconductor chip, and semiconductor wafer including a variable thickness insulating layerSEIKO EPSON CORP·Filed 2004·Granted Apr 15, 2008·49 cites·10 claims
- 0385US11693545B2Device and method for arranging objects displayed on divided areas in a vehicle displayFAURECIA CLARION ELECTRONICS CO LTD·Filed 2020·Granted Jul 4, 2023·2 cites·12 claims
- 0485US8804316B2Electronic device package, electronic device, and electronic apparatusSHIRAKI MANABU·Filed 2012·Granted Aug 12, 2014·8 cites·20 claims
- 0582US7410908B2Manufacturing method for a semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Aug 12, 2008·9 cites·11 claims
- 0682US7402503B2Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatusSEIKO EPSON CORP·Filed 2005·Granted Jul 22, 2008·9 cites·22 claims
- 0779US7387945B2Semiconductor chip, semiconductor device and electronic equipment including warpage control film, and manufacturing method of sameSEIKO EPSON CORP·Filed 2005·Granted Jun 17, 2008·9 cites·20 claims
- 0878US8796823B2Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatusSEIKO EPSON CORP·Filed 2012·Granted Aug 5, 2014·3 cites·14 claims
- 0974US8330256B2Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatusYODA TSUYOSHI·Filed 2009·Granted Dec 11, 2012·5 cites·14 claims
- 1058US9257404B2Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatusSEIKO EPSON CORP·Filed 2014·Granted Feb 9, 2016·0 cites·7 claims
- 1137US2004245623A1Semiconductor device, circuit substrate and electronic instrumentFiled 2004·Application pending·0 cites
- 1236US2004192033A1Semiconductor device, method of manufacturing the same, circuit board, and electronic instrumentFiled 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →