Inventor · disambiguated record
Hidehisa Yamazaki
Also filed as: YAMAZAKI HIDEHISA
3 granted patents·178 citations·filing 1996–1997
77Inventor score
Files withYAMAICHI ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0183US5973395AIC package having a single wiring sheet with a lead pattern disposed thereonYAMAICHI ELECTRONICS CO LTD·Filed 1997·Granted Oct 26, 1999·83 cites·28 claims
- 0280US5950306ACircuit boardYAMAICHI ELECTRONICS CO LTD·Filed 1996·Granted Sep 14, 1999·53 cites·3 claims
- 0376US6243946B1Method of forming an interlayer connection structureYAMAICHI ELECTRONICS CO LTD·Filed 1997·Granted Jun 12, 2001·42 cites·14 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →