Inventor · disambiguated record
Jun-Cheng Ko
Also filed as: KO JUN-CHENG
7 granted patents·1 pending application·170 citations·filing 1996–2005
87Inventor score
Top patents by PatentIndex Score
8 records- 0188US5817579ATwo step plasma etch method for forming self aligned contactVANGUARD INT SEMICONDUCT CORP·Filed 1997·Granted Oct 6, 1998·96 cites·19 claims
- 0260US6861362B2Self-aligned contact process implementing bias compensation etch endpoint detection and methods for implementing the sameLAM RES CORP·Filed 2001·Granted Mar 1, 2005·7 cites·19 claims
- 0356US5854135AOptimized dry etching procedure, using an oxygen containing ambient, for small diameter contact holesVANGUARD INT SEMICONDUCT CORP·Filed 1997·Granted Dec 29, 1998·24 cites·10 claims
- 0449US5915198AContact process using taper contact etching and polycide stepVANGUARD INT SEMICONDUCT CORP·Filed 1997·Granted Jun 22, 1999·14 cites·10 claims
- 0547US6211557B1Contact structure using taper contact etching and polycide stepVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Apr 3, 2001·12 cites·6 claims
- 0645US2005130334A1Self-aligned contact process implementing bias compensation etch endpoint detection and methods for implementing the sameLAM RES CORP·Filed 2005·Application pending·0 cites
- 0740US6069077AUV resist curing as an indirect means to increase SiN corner selectivity on self-aligned contact etching processVANGUARD INT SEMICONDUCT CORP·Filed 1997·Granted May 30, 2000·9 cites·28 claims
- 0838US5788767AMethod for forming single sin layer as passivation filmVANGUARD INT SEMICONDUCT CORP·Filed 1996·Granted Aug 4, 1998·8 cites·17 claims
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