Inventor · disambiguated record
Hajime Momoi
Also filed as: MOMOI HAJIME
4 granted patents·1 pending application·9 citations·filing 2010–2017
64Inventor score
Top patents by PatentIndex Score
5 records- 0189US9724896B2Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2015·Granted Aug 8, 2017·8 cites·21 claims
- 0268US10464291B2Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2017·Granted Nov 5, 2019·1 cites·24 claims
- 0345US10843934B2High purity tungsten pentachloride and method for synthesizing sameJX NIPPON MINING & METALS CORP·Filed 2017·Granted Nov 24, 2020·0 cites·16 claims
- 0431US2012104502A1Method of producing semiconductor device, and semiconductor deviceIMORI TORU·Filed 2010·Application pending·0 cites
- 0525US8643060B2Method for manufacturing epitaxial crystal substrate, epitaxial crystal substrate and semiconductor deviceMOMOI HAJIME·Filed 2011·Granted Feb 4, 2014·0 cites·18 claims
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